81-21-0 Usage
Description
Dicyclopentadiene diepoxide is a chemical compound derived from dicyclopentadiene, featuring two epoxy groups in its structure. It is known for its reactive nature and ability to form polymers, making it a versatile building block in various chemical processes.
Uses
Used in Chemical Synthesis:
Dicyclopentadiene diepoxide is used as an intermediate for the production of epoxy resins, which are essential components in coatings, adhesives, and composite materials due to their excellent adhesion, mechanical properties, and chemical resistance.
Used in Plasticizer Production:
It serves as a key intermediate in the synthesis of plasticizers, which are additives that increase the flexibility and workability of plastics, making them more suitable for various applications.
Used in Protective Coatings:
Dicyclopentadiene diepoxide is utilized in the formulation of protective coatings, providing enhanced durability and resistance to environmental factors such as UV radiation, moisture, and chemicals.
Used in Rubber Industry:
As a rubber additive, dicyclopentadiene diepoxide contributes to the improvement of rubber properties, such as tensile strength, abrasion resistance, and heat resistance, making it suitable for high-temperature applications.
Used in Adhesives:
It is employed in the production of high-performance adhesives, which offer strong bonding capabilities and resistance to high temperatures, making them ideal for use in various industries.
Used in Pharmaceutical Synthesis:
Dicyclopentadiene diepoxide is used in the preparation of endo-3-hydroxy-exo-9-oxa-exo-tetracyclo[5.3.1.02,6.08,10]undecane, a compound synthesized using lithium aluminum hydride as a reagent, which may have potential applications in the pharmaceutical industry.
Safety Profile
Poison by ingestion andintravenous routes. Mildly toxic by skin contact. A skinirritant. When heated to decomposition it emits acridsmoke and irritating fumes.
Check Digit Verification of cas no
The CAS Registry Mumber 81-21-0 includes 5 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 2 digits, 8 and 1 respectively; the second part has 2 digits, 2 and 1 respectively.
Calculate Digit Verification of CAS Registry Number 81-21:
(4*8)+(3*1)+(2*2)+(1*1)=40
40 % 10 = 0
So 81-21-0 is a valid CAS Registry Number.
InChI:InChI=1/C10H12O2/c1-4-3-2-6-10(11-6)7(3)5(1)9-8(4)12-9/h3-10H,1-2H2
81-21-0Relevant articles and documents
Synthesis of new azapolycyclic scaffolds via the domino aminolysis of dicyclopentadiene diepoxide in water
Palchykov, Vitalii A.,Gaponova, Rita G.,Omelchenko, Iryna V.,Kasyan, Liliya I.
supporting information, (2020/06/17)
A convenient method is reported for the multigram scale synthesis of compounds containing the novel octahydro-1H-2,5-epimino-4,7-methanoindene azapolycyclic system in good yields. This method involves the domino aminolysis of readily available dicyclopentadiene diepoxide in water at 165 °C. 2D NMR and XRD spectra of the products were studied in detail.
Preparation method of dicyclopentadiene dioxide based on modified nano aluminum oxide loaded heteropolyacid type compound catalyst
-
Paragraph 0033-0046, (2020/05/14)
The invention discloses a method for preparing dicyclopentadiene dioxide by catalytic oxidation of dicyclopentadiene serving as a raw material in the presence of a solvent through a suspended bed or afixed bed reactor by taking a modified nano aluminum oxide loaded heteropolyacid type compound as a catalyst and hydrogen peroxide as an oxidant. Compared with the prior art, the preparation method provided by the invention has the advantages that the catalyst is long in service life, stable in performance, simple to separate and high in product yield, and the reaction yield of dicyclopentadienedioxide is greater than 96%.
COMPOSITION FOR CURABLE RESIN, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE
-
Paragraph 0158-0160, (2020/11/30)
The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).