Dimer,Parylene F

Base Information

• Chemical Name: Dimer,Parylene F
• CAS No.: 1785-64-4
• Molecular Formula: C16H8 F8
• Molecular Weight: 352.227
• Mol file: 1785-64-4.mol

Synonyms:5,6,11,12,13,14,15,16-Octafluorotricyclo[8.2.2.24,7]hexadeca-4,6,10,12,13,15-hexaene

Chemical Property of Dimer,Parylene F

Chemical Property:

• Melting Point: >205 °C (sublm)
• Boiling Point: 321 ºC
• Flash Point: 117 ºC
• PSA: 0.00000
• Density: 1.497
• LogP: 4.68320
• Storage Temp.: 2-8°C
• Solubility.: soluble in Toluene

Purity/Quality:

99% ^*data from raw suppliers

ParyleneFDimer ^*data from reagent suppliers

Safty Information:

• Pictogram(s):  
• Hazard Codes: 

MSDS Files:

SDS file from LookChem

Useful:

• Description: Parylene F Dimer is the solid, granular starting material used to produce parylene conformal coating films. Parylene F brings allows for parylene performance at higher operating temperatures, along with similar barrier and dielectric protection of other parylene types.
• Physical properties: TYPICAL PROPERTIES OF DEPOSITED PARYLENE F FILMGas Permeability, O2: 16.7 (cc*mm)/(m2*day*atm)Short Term Service Temperature: 250℃Continuous Service Temperature: 200℃Coefficient of Friction (Static and Dynamic): 0.35Rockwell Hardness: R80Tensile Strength: 7,800 psiPenetration Power: 30 XDielectric Strength @ 1 mil: 7.0 KVUSP Class VI Polymer: Yes
• Uses: Parylene type materials have been widely used in electronic products, Parylene family of commercially valuable types of materials are divided into four types, respectively, Parylene N, Parylene C, Parylene F, Parylene Ht.Parylene is applied with a vapor deposition process performed in a customized vacuum system. There is no curing involved. Typical coating thickness ranges from 2-50 microns.Barrier layer protection for high temperature applications.Protects devices from moisture, bodily fluids, corrosive gases, vapors, liquids and other contamination.Waterproof electronics up to IPX8 protection level and meet requirements for IPC, MIL specs and NASA standards.Prevents corrosion of printed circuit boards and electronic components.Dielectric layer to protect electronics from shorts and arcing.Thin film encapsulation is used to protect electronics from vibration or shock.Tin whisker mitigation

Technology Process of Dimer,Parylene F

There total 10 articles about Dimer,Parylene F which guide to synthetic route it. The literature collected by LookChem mainly comes from the sharing of users and the free literature resources found by Internet computing technology. We keep the original model of the professional version of literature to make it easier and faster for users to retrieve and use. At the same time, we analyze and calculate the most feasible synthesis route with the highest yield for your reference as below:

synthetic route:

Reference yield: 97.0%

C14H22F4NSi(1+)*C7H7O3S(1-) → 4,5,7,8,12,13,15,16-octafluoro(2.2)paracyclophane (1785-64-4)

Guidance literature:

With sodium hydroxide; In water; at 65 ℃; for 0.025h;

Reference yield: 58.2%

α,α'-dichloro-2,3,5,6-tetrafluoro-1,4-xylene (131803-37-7) → 4,5,7,8,12,13,15,16-octafluoro(2.2)paracyclophane (1785-64-4)

Guidance literature:

With 4-tert-Butylcatechol; tetrabutyl-ammonium chloride; zinc; In 1,4-dioxane; at 80 ℃; Solvent; Temperature; Reagent/catalyst;

Reference yield: 42.0%

10H-phenothiazine (92-84-2) + Trimethyl-(2,3,5,6-tetrafluoro-4-methyl-benzyl)-ammonium; hydroxide → 4,5,7,8,12,13,15,16-octafluoro(2.2)paracyclophane (1785-64-4)

Guidance literature:

In toluene; for 8h; Heating;

DOI:10.1016/S0022-1139(00)85095-2

upstream raw materials:

10H-phenothiazine

5,6,8,9,14,15,17,18-octafluoro-2,11-dithia(3.3)-paracyclophane

1,4-dimethyl-2,3,5,6-tetrafluorobenzene

α,α’-dibromo-m-tetrafluoroxylene

Refernces

• 1、 -. "Octafluorofluoro-cyclic di-p-xylyene and synthesis method thereof". Paragraph 0049-0073. . Retrieved 2019/02/04.