Reference

A new liquid aromatic diamine curative for polyurethane cast elastomers

A new liquid aromatic diamine curative for polyurethane cast elastomers. Nalepa, C. J.; Eisenbraun, A. A. (Ethyl Tech. Cent., Ethyl Corp., Baton Rough, LA 70898, USA). Proc. SPI Annu. Tech./Mark. Conf., 30th(Polyurethanes), 228-33 (English) 1986. CODEN: PSACEV. ISSN: 0740-8897. DOCUMENT TYPE: Journal CA Section: 39 (Synthetic Elastomers and Natural Rubber) Ethacure 300 [106264-79-3] [di(methylthio)toluenediamine] is a high-performance liq. curative for TDI polyurethane rubber. This curative offers significant advantages over other curatives with respect to handling, versatility, and cost.

The structural and mechanical properties of polysulfide-based polyurea

The structural and mechanical properties of polysulfide-based polyurea. Dong, Wenzhao; Quan, Yiwu; Zhang, Junsheng; Chen, Qingmin ( Department of Polymer Science & Engineering, Nanjing University, Nanjing 210093, Peop. Rep. China). Polymer International, 52(12), 1925-1929 (English) 2003 John Wiley & Sons Ltd. CODEN: PLYIEI. ISSN: 0959-8103. DOCUMENT TYPE: Journal CA Section: 37 (Plastics Manufacture and Processing) Section cross-reference(s): 39 A series of polysulfide-based polyureas was synthesized, which were based on isophorone diisocyanate (IPDI), liq. polysulfide and 2,5-diamino-3,6-dimethylmercaptotoluene (Ethacure-300). The structure and mech. properties of these elastomers were investigated using dynamic mech. thermal anal., differential scanning calorimetry, stress-strain anal., water-resistance and oil-resistance tests. The results showed that there was phase segregation between soft and hard segments in polysulfide-based polyurea. With the increase in no. 647019-07-6 and 106264-79-3 which are cas registry numbers of chemicals are mentioned.-av. relative molar mass and content of liq. polysulfide, the tensile strength decreased while the ultimate elongation increased. The effect of no.-av. relative molar mass of polysulfide and hard-segment content on oil resistance is also discussed. .