Reference

Copper plating solution

Copper plating solution. (Toshiba Corp., Japan). Jpn. Kokai Tokkyo Koho JP 58217669 A2 17 Dec 1983 Showa, 6 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C23C003-02. APPLICATION: JP 82-100624 14 Jun 1982. DOCUMENT TYPE: Patent CA Section: 55 (Ferrous Metals and Alloys) Section cross-reference(s): 46 The Cu film having good ductility is formed on stainless steel by electroless coating from a soln. contg. a Cu salt, a chelating agent, a reducing agent, a pH control agent, phosphate-ester cationic and nonionic surfactants, and optionally 31 of 1,10-phenanthroline [66-71-7] and its derivs., 2,2'-dipyridyl [366-18-7], 2,2'-biquinoline [119-91-5], and water-sol. cyanides. Thus, cleaned surfaces of a stainless steel strip were activated in 2-stage dipping and rinsing with a 1st soln. contg. 50 g SnCl2/L and 10 mL HCl/L, and a 2nd soln. contg. 0.25 g PdCl2/L and 10 mL HCl/L. The activated strip was coated in an electroless aq. soln. (70°, pH 12.3) contg. CuSO4.5H2O 12.5, tetra-Na ethylenediaminetetraacetate [64-02-8] 15, p-HCHO 4.5, RE-610 [51811-79-1] 0.25, PEG 1000 [25322-68-3] 0.1 g/L, and NaOH. 25322-68-3 and 7440-50-8 are just another two chemicals used in this study. Resulting Cu film was 30-65m thick on each side. The films had 42 kg/mm2 tensile strength and 4.5% elongation. .

Copper electroless coating solutions

Copper electroless coating solutions. (Suwa Seikosha Co., Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 60009880 A2 18 Jan 1985 Showa, 7 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: ICM: C23C018-40. APPLICATION: JP 83-117292 29 Jun 1983. DOCUMENT TYPE: Patent CA Section: 56 (Nonferrous Metals and Alloys) The Cu electroless coating soln. contains Cu ions, Cu ion complexing agent, Cu ion redn. agent, alkali hydroxide, 31 a-amino acids, polyalkylene glycol, and 31 2,2'-dipyridyl (I) [366-18-7], 2,2'-biquinoline [119-91-5], 1,10-phenanthroline [66-71-7], and 1,10-phenanthroline derivs. The soln. gives a Cu coating having high elongation, flexibility, and tensile strength. Thus, a soln. at pH 12.3 and 70° and contg. CuSO4.5H2O, EDTA Na salt, HCNO, NaOH, aminoacetic acid [56-40-6], I, and polyethylene glycol [25322-68-3] gave a Cu coating having an elongation of 5.2% and tensile strength 46.2 kg/mm2, compared to 4.5% and 33.2 kg/mm2 for the coating prepd. without the use of I.