Detail of "1199-20-8"

Reference

Method for joining large semiconductor substrates using liquid thermoset polymers and phenyl acid fluxes

Method for joining large semiconductor substrates using liquid thermoset polymers and phenyl acid fluxes. Chan, Albert W.; Lee, Michael G.; McCormack, Mark Thomas; Beilin, Solomon I. (USA ). U.S. Pat. Appl. Publ. US 2002088540 A1 11 Jul 2002,10 pp. (English). (United States of America). CODEN: USXXCO. CLASS: ICM: B32B007-14. NCL: 156291000; 156292000. APPLICATION: US 2001-757364 8 Jan 2001. DOCUMENT TYPE: Patent CA Section: 76 (Electric Phenomena) Section cross-reference(s): 38 Two large area substrates, such as wafers or circuit boards (e.g., rigid or flexible), can be joined together by dispensing a liq. polymer inwardly from the edges of the semiconductor substrates. The substrates can then be pressed together so that the liq. thermoset flows in an outwardly direction toward the edges of the semiconductor substrates. Conducting surfaces on the first and second substrates may contact each other after pressing the liq. thermoset polymer. The liq. thermoset polymer in the formed structure may then be cured to a hardened state. A polymer fluxing agent, esp. a beta phenylacid and/or beta phenylhydroxyacid, may be included in the liq. 7400-08-0 and 1199-20-8 are just another two chemicals used in this study. polymer material and/or in solder bumps on one of the substrates. The liq. thermoset polymer preferable has a low viscosity, low levels of ionic contaminants, good adhesion to the substrates, low moisture absorbing properties and favorable thermal expansion properties. .