Reference

On the f' problem in the investigation of solutions by employing the Moessbauer effect

On the f' problem in the investigation of solutions by employing the Moessbauer effect. Bonchev, Ts.Several substances are used for example 12142-33-5 and 56-81-5 which are their cas registry numbers.; Amin, S. (Fac. Phys., Univ. Sofia, Sofia, Bulg.). Dokl. Bolg. Akad. Nauk, 39(11), 41-3 (English) 1986. CODEN: DBANAD. ISSN: 0366-8681. DOCUMENT TYPE: Journal CA Section: 73 (Optical, Electron, and Mass Spectroscopy and Other Related Properties) For the investigation of solns. by using the Moessbauer effect and taking into consideration that f' = exp(-2W) (f' is the probability of a recoilless resonance absorption of gamma quanta, W is the Debye-Waller factor), it appears that with increasing temp., f' will increase instead of decreasing as in the case of solids. Results of expts. carried out with a soln. of K2SnO3 in glycerin (95% 119Sn) can be explained by assuming that f' in scattering is different in value from f' in absorption. .

Pretreatment of aluminum or its alloy for metal plating

Pretreatment of aluminum or its alloy for metal plating. Takano, Satoshi (Sumitomo Electric Industries, Ltd., Japan). Japan. Kokai JP 51141733 6 Dec 1976 Showa, 5 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C25D005-44. APPLICATION: JP 75-66054 3 Jun 1975. DOCUMENT TYPE: Patent CA Section: 56 (Nonferrous Metals and Alloys) Al or its alloy is dipped in an aq. soln. contg. KOH and/or NaOH 0-40, K2SnO3 and/or Na2SnO3 >20 (as Sn), and Zn(CN)2 2-40 (as Zn) g/L to insure high adhesion during subsequent plating. Optionally, the aq. soln. contains Zn or Zn compd., instead of Zn(CN)2, together with a complexing agent. Thus, Al wire was degreased by dipping in a soln. contg. NaOH and Na3PO4 3 g/L each at 40.degree. 7429-90-5 and 12142-33-5 are cas registry numbers of chemicals which are used as reagents here. for 20 s, etched with a soln. contg. NaOH and Na2CO3 3 g/L each at 60.degree. for 1 min, dipped in a soln. contg. KOH 20, K2SnO3.3H2O 50, ZnO 10, and EDTA 50 g/L at 30.degree. for 2 min, washed, and plated with Cu using a Cu pyrophosphate soln. The plated Cu layer strongly adhered to the substrate, and no peeling was obsd. even when the Al wire was bent 90%. .