Reference

Insulated electric wire

Insulated electric wire. (Furukawa Electric Co., Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 58150219 A2 6 Sep 1983 Showa, 4 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: H01B013-16; B05D007-20. APPLICATION: JP 82-33643 3 Mar 1982. DOCUMENT TYPE: Patent CA Section: 38 (Plastics Fabrication and Uses) A conductor is coated with a powd. epoxy or polyester resin, heated to partially cure the resin, coated with an org. solvent optionally contg. an insulating coating material, and heated to prep. an insulated wire. Thus, a Cu wire was coated with powd. Epx 6110 [88984-55-8] (an epoxy resin), passed (12 m/min) through an oven at 300° and a bath contg. cresol [1319-77-3], and heated at 400° to prep. an insulated wire having voltage resistance 10.0 kv, softening temp. 195°, and abrasion resistance 15 times, compared with 1.In this experiment, several chemicals are used like 88984-55-8 and 1319-77-3 2, 150, and 9, resp., for an insulating coating prepd. in the absence of cresol. .

Sealing resin compositions for semiconductor devices

Sealing resin compositions for semiconductor devices. (Nitto Electric Industrial Co., Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 58164250 A2 29 Sep 1983 Showa, 3 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: H01L023-30; C08K003-36. APPLICATION: JP 82-46611 24 Mar 1982. DOCUMENT TYPE: Patent CA Section: 38 (Plastics Fabrication and Uses) Section cross-reference(s): 76 Sealing compns. contain 60-85% filler which is a mixt. of 30-70% powd. fused silica contg. >30% granules of >46 m and <1% granules of >1.49 m and powd. cryst. silica contg. <1% granules of >46 m and >60% granules of <10 m. Thus, a sealing compn. was prepd. from a cresol novolak epoxy resin 16, a fire-resistant epoxy resin 2.5, a phenol novolak resin 8. 1319-77-3 and 60676-86-0 are cas registry numbers of chemicals which are used as reagents here.0, 2-methylimidazole 0.4, carnauba wax 0.3, a silane coupling agent 0.5, Sb2O3 1.8, carbon black 0.3, fused silica (>149 m 0.7, <46 m 67, and <10 m 27) 35, and cryst. silica (>149 m 0, <46 m 99, and <10 m 71) 35 parts, and had spiral flow 85 cm, fin length <1 mm, and low mold wear, compared with 62, 3, and low, resp., for a sealing compn. contg. 56 parts fused silica and 14 parts cryst. silica. .