Detail of "13255-26-0"

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Photoluminescence of a BaSiO3:Yb3+ crystal

All Rights Reserved. Photoluminescence of a BaSiO3:Yb3+ crystal. Tagiev, O. B. 13255-26-0 and 18923-27-8 are cas registry numbers. These chemicals are also mentioned in this article.; Abushov, S. A.; Kazymova, F. A.; Tagiev, K. O. (Institute of Physics, National Academy of Sciences of Azerbaijan, Baku AZ1143, Azerbaijan). Journal of Applied Spectroscopy, 73(4), 541-545 (English) 2006 Springer. CODEN: JASYAP. ISSN: 0021-9037. DOCUMENT TYPE: Journal CA Section: 73 (Optical, Electron, and Mass Spectroscopy and Other Related Properties) We present the results of a study of the luminescence and luminescence excitation spectra, and also the luminescence kinetics of a BaSiO3:Yb3+ crystal. We have established the mechanism for emission by the matrix and energy transfer from the matrix to the rare earth ion. .

Method for producing molding compound including fluorescent materials and method for manufacturing light emitting diode device employing molding compound

All Rights Reserved. Method for producing molding compound including fluorescent materials and method for manufacturing light emitting diode device employing molding compound. Chan, Shih-Hsiung; Tseng, Jian-Shihn (Advanced Optoelectronic Technology Inc., Taiwan). Taiwan. TW 251352 B 11 Mar 2006, 6pp. 13255-26-0 and 13778-49-9 are cas registry numbers. These chemicals are also mentioned in this article. (Chinese). (Taiwan). CODEN: TWXXA5. CLASS: ICM: H01L031-0203. APPLICATION: TW 2005-94119806 15 Jun 2005. DOCUMENT TYPE: Patent CA Section: 73 (Optical, Electron, and Mass Spectroscopy and Other Related Properties) The present invention is related to a method for producing molding compd. including fluorescent materials. At first, a light-emitting diode (LED) chip is provided, and the LED chip is fixed and elec. connected to the substrate or the lead-frame. Then, the molding compd. having the mixed fluorescent material is used to cover on the LED chip, in which the fluorescent material is composed of at least one compd. selected from the europium (Eu) activated alk.-earth oxide, the Eu activated silica, the Eu activated quasi-silica, and the Eu activated phosphite. In addn., the fluorescent material and the molding compd. are mixed before the kneading process or in the kneading process. The molded substrate or the lead-frame is cut to form plural independent light-emitting devices. The fluorescent material absorbs the initial light emitted from the light-emitting diode chip to generate fluorescent light different from the initial light such that it is capable of mixing the initial light with the fluorescent light to form the required white light or color light. .