Reference

Grids for lead storage batteries

Grids for lead storage batteries. Kiessling, Reiner (Accumulatorenfabriken Wilhelm Hagen A.-G. Soest-Kassel-Berlin, Ger.). Ger. Offen. DE 2540937 17 Mar 1977, 11 pp. (German). (Germany). CODEN: GWXXBX. CLASS: IC: H01M004-73. APPLICATION: DE 75-2540937 13 Sep 1975. DOCUMENT TYPE: Patent CA Section: 52 (Electrochemical, Radiational, and Thermal Energy Technology) Section cross-reference(s): 60 Electrode grids for Pb-acid batteries are prepd. by electrodeposition of Pb on a steel, Cu, or Al substrate grid from a soln.There are some commonly used reagents with their cas registry numbers 123-31-9 and 12671-80-6 in this article. contg. 320 Pb(BF4)2 [13814-96-5], 30 HBF4 and 10 hydroquinone [123-31-9], or 350 PbSiF6 [25808-74-6], 30 H2SiF6, and 2 g gelatin/L, the anodes being prepd. by remelting of the electrode scrap of Pb-acid batteries. .

Approaches to surface-mount technology

Approaches to surface-mount technology. Langan, James P.Several substances are used for example 13814-96-5 and 13814-97-6 which are their cas registry numbers. (Enthone Inc., W. Haven, CT 06516, USA). Plat. Surf. Finish., 74(3), 52-5 (English) 1987. CODEN: PSFMDH. ISSN: 0360-3164. DOCUMENT TYPE: Journal CA Section: 76 (Electric Phenomena) Section cross-reference(s): 56, 72 The methods of bonding surface-mount components to PC (printed-circuit)-boards which consist of wave soldering or fusing solder paste are discussed. In wave soldering, an adhesive holds the component in place prior to soldering. To electrodeposit a high-purity Sn-Pb coating of solder low in contaminates, the plating soln. must be electrolyzed frequently at low c.d. to remove harmful metallic impurities such as Cu. In fusing solder paste, the paste acts as the adhesive and source of the flux-solder alloy. Oxide-free powder and innovative paste formulations are essential to avoid solder balls. In heavy, fused solder electroplating, a viscous flux is applied to the areas to be soldered to assembly and serves the dual function of the adhesive and the flux. These processes eliminate the possibility of solder balls. .