Detail of "1478-61-1"

CAS Number:
1478-61-1
Name:
Phenol,4,4'-[2,2,2-trifluoro-1-(trifluoromethyl)ethylidene]bis-
Superlist Name:
4,4'-(Hexafluoroisopropylidene)diphenol
Molecular Structure:
Formula:
C₁₅H₁₀F₆O₂
Molecular Weight:
336.25
Deleted CAS:
110444-90-1
Synonyms:
Phenol,4,4'-[2,2,2-trifluoro-1-(trifluoromethyl)ethylidene]di- (6CI,7CI);1,1,1,3,3,3-Hexafluoro-2,2-bis(4-hydroxyphenyl)propane;2,2-Bis(4-hydroxyphenyl)hexafluoropropane;BIS-AF;Bisphenol AE;Cheminox BAF;GP 21;Hexafluorobisphenol A;Hexafluoroisopropylidenebis(4-hydroxybenzene);NSC152522;
EINECS:
216-036-7
Density:
1.447 g/cm³
Melting Point:
160-163 °C(lit.)
Boiling Point:
344.1 °C at 760 mmHg
Flash Point:
161.9 °C
Appearance:
White to off-white powder
Hazard Symbols:
Xi
Risk Codes:
36/37/38
Safety:
26-36-37/39 Details

Fluorine-containing polyamides and polyimides: Fluorine-containing polyamides and polyimides. (Hitachi, Ltd.; Hitachi Chemical Co., Ltd., Japan). Jpn.Chemicals with cas numbers 89458-55-9 and 89458-57-1 also play role. Kokai Tokkyo Koho JP 58180530 A2 22 Oct 1983 Showa, 10 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C08G073-10; C08G069-26. APPLICATION: JP 82-63855 19 Apr 1982. DOCUMENT TYPE: Patent CA Section: 35 (Chemistry of Synthetic High Polymers) The heat- and moisture-resistant title polymers, useful in electronic devices, are based on 2,2-bis[4-(3-aminophenoxy)phenyl]hexafluoropropane (I) [88821-04-9], obtained by redn. of 2,2-bis[4-(3-nitrophenoxy)phenyl]hexafluoropropane [89444-71-3], prepd. from 2,2-bis(4-hydroxyphenyl)hexafluoropropane [1478-61-1] and m-chloronitrobenzene [121-73-3]. Thus, a soln. of 36.95 g I in 297.5 g N-methyl-2-pyrrolidone at 5° was treated with 15.55 g pyromellitic dianhydride in small portions, polymd. at room temp. for 2 h, heated at 80-85° to viscosity (20°) 100 P, cast, and heated at 150° for 1 h and then at 300° for 2 h to give a tough film with satn. moisture absorption (25°, 75% relative humidity) 0.58% and heat resistance in air (temp. of 5% wt. loss at heating rate 5°/min) 470°. .

Polyimides prepared from perfluoroisopropylidene diamine: Jones, Robert J.; O'Rell, Michael K.; Hom, Jim M. (TRW Inc., USA). U.S. US 4111906 5 Sep 1978, 4 pp. (English). (United States of America). CODEN: USXXAM. CLASS: IC: C08G073-10. NCL: 528229000. APPLICATION: US 76-706880 19 Jul 1976. DOCUMENT TYPE: Patent CA Section: 35 (Synthetic High Polymers) Section cross-reference(s): 25 An arom. F-contg. diamine was prepd. and used in the manuf. of heat-resistant polyimides. Thus, 2,2-bis(4-hydroxyphenyl)hexafluoropropane [1478-61-1] was condensed with 4-chloronitrobenzene [100-00-5] to give 93% 2,2-bis[4-(4-nitrophenoxy)phenyl]hexafluoropropane [69563-87-7] which was reduced to the resp. diamine (I) [69563-88-8]. An equimolar amt. of benzophenonetetracarboxylic acid dianhydride in AcNMe2 was added dropwise to the I soln. under N with cooling. The intermediate polyamic acid was imidized by heating 4 h to 180° to give a tough flexible polyimide [69572-62-9] of inherent viscosity 0.47 dL/g (H2SO4, 30°); initial wt. loss occurred at 420° (in air).