Detail of "15537-82-3"

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Ni-W/Mo/lanthanide mixed-rare earth metal electroless plating solution and plating method using the same

Ni-W/Mo/lanthanide mixed-rare earth metal electroless plating solution and plating method using the same. Eom, Tae In; Kang, Yong Hyeok (S. Korea ). Repub. Korean Kongkae Taeho Kongbo KR 2003039708 A 22 May 2003,No pp. given (Korean). (Korea, Republic Of). CODEN: KRXXA7. CLASS: ICM: C23C018-32. APPLICATION: KR 2001-70734 14 Nov 2001. DOCUMENT TYPE: Patent CA Section: 56 (Nonferrous Metals and Alloys) Ni-W/Mo/Lanthanide mixed-rare earth metal electroless plating soln. and a plating method using the same are provided. The Ni-W/Mo/Lanthanide mixed-rare earth metal electroless plating soln. contains, in 1 L of distd.There are some reagents with their cas registry numbers 15537-82-3 and 831172-04-4 are used in this study. water, nickel sulfate 5 to 15g, sodium tungstate 20 to 35g, molybdenum 25 to 35g, Lanthanide mixed-rare earth metal 0.1 to 5g, sodium citrate 10 to 15g, sodium hypophosphate 5 to 10g and molybdenum ionic surfactant 0.7 to 2.0 g/25cc, wherein the ionic surfactant is dioctyl phthalate+phthyl cellosolve; the diam. is molybdenum is 0.1 to 1.0 mm; the diam. of Lanthanide mixed-rare earth metal is 0.1 to 2.3 mm. The plating method using Ni-W/Mo/Lanthanide mixed-rare earth metal electroless plating soln. includes the steps of completely dissolving nickel sulfate 5 to 15g, sodium tungstate 20 to 35g in 1 L of distd. water; secondary dissolving sodium citrate 10 to 15g, sodium hypophosphate 5 to 10g in the distd. water; adding 25 to 35g of molybdenum with a particle size of 0.1 to 1.0 mm, 0.1 to 5g of Lanthanide mixed-rare earth metal with a particle size of 0.1 to 2.3 mm and 0.7 to 2.0 g/25cc of molybdenum ionic surfactant in the distd. water; plating a specimen to be plated in a thickness of 7 to 10 mm at pH 9.0 to 9.8 at plating soln. temp. of 85 to 90°C; and heat treatment at 350 to 450°C for about 30 min. .

Study of electroless Ni-P-B plating on aluminum alloys

All Rights Reserved. Study of electroless Ni-P-B plating on aluminum alloys. Kang, Zhongming; Peng, Qiubo; Dai, Mingjiang; Kuang, Min (Surface Engineering Center, Guangzhou Research Institute of Nonferrous Metals, Guangzhou 510651, Peop. Rep. China). Diandu Yu Tushi, 24(2), 11-14 (Chinese) 2005 Diandu Yu Tushi Bianjibu. CODEN: DYTUEM. ISSN: 1004-227X. DOCUMENT TYPE: Journal CA Section: 56 (Nonferrous Metals and Alloys) A Ni deposit with low P and B contents was prepd. on an Al alloy with dimethylamine-borane complex (DMAB) as reducing agent. The effects of Ni2SO4, NaH2PO2, DMAB, complexing agent, pH, and stabilizing agent on the deposition rate, microhardness, and microstructure of deposit were studied. 15537-82-3 and 62-56-6 which are cas registry numbers are also used here. The optimal process conditions were decided: Ni2SO4 24, NaH2PO2 12 g/L, thiourea (stabilizing agent) 3, Na dodecyl sulfate 8 mg/L, complexing agent 30 mL/L, DMAB as required, temp. 73-75°, and pH 6.2-6.4. The deposit prepd. under the optimal conditions contained P 1.81, B 0.26, and Ni 97.93%, showed good adhesion to substrate, and had a microhardness 550-710 HV. The deposit was applied to Al-based pistons, showing satisfactory results. .