Detail of "16068-37-4"

Reference

Binding inorganic materials

Binding inorganic materials. Roth, Michael; Gogolok, Konrad (Wacker-Chemie G.m.b.H., Ger.). Ger. Offen. DE 2632835 26 Jan 1978, 13 pp. (German). (Germany). CODEN: GWXXBX. CLASS: IC: C04B041-28. APPLICATION: DE 76-2632835 21 Jul 1976. DOCUMENT TYPE: Patent CA Section: 58 (Cement and Concrete Products) The compressive strength of mortar is increased by coating it with bis(trialkoxysilyl)alkanes, e.g. bis(triethoxysilyl)ethane (I) [16068-37-4] and optionally with siloxanes for water-proofing. Thus, 450 g of a mixt. of lime 2, portland cement 1, sand 8.5, and Fe oxide 0.5 parts were mixed with sand 1350 and water 250 g, molded, hardened 24 h, and dried 14 days. Immersion of the product in 75 parts I and 25 parts of a mixt. of 2-butanone 18,000, acetone 5.75, and dibutyltindilaurate 1.25 g for 3 min and storage at 100% relative humidity for 4 wk resulted in compressive strength 85.2 kg/cm2 compared to 3.2 kg/cm2 when no I is used.

Conductive one-part room temperature curing silicone paste composition comprising one-part room temperature curing silicone resin, conductive metal powder, silane compound having 3-4 alkoxy functional groups and organic solvent

All Rights Reserved. Conductive one-part room temperature curing silicone paste composition comprising one-part room temperature curing silicone resin, conductive metal powder, silane compound having 3-4 alkoxy functional groups and organic solvent. Park, Young Hee (Research Institute of Industrial Science & Technology, S. Korea). Repub. Korean Kongkae Taeho Kongbo KR 2005064088 A 29 Jun 2005, No pp. given (Korean). (Korea, Republic Of). CODEN: KRXXA7. CLASS: ICM: C09J183-00. APPLICATION: KR 2003-95365 23 Dec 2003. DOCUMENT TYPE: Patent CA Section: 38 (Plastics Fabrication and Uses) Provided are a conductive one-part room temp. curing silicone paste compn., and its prepn. method, to prevent the sepn. of a conductive metal powder from a silicone resin due to the difference of sp. 16068-37-4 and 18406-41-2 which are cas registry numbers are also used here. gr., thereby optimizing the cond. of a metal powder in molding process. The conductive one-part room temp. curing silicone paste compn. comprises 20-40 parts a one-part room temp. curing silicone resin; 60-80 parts a conductive metal powder; 0.1-0.5 parts a silane compd. having three or four alkoxy functional groups based on 100 parts of the silicone resin and the conductive metal powder; and 0.1-25 parts of an org. solvent based on 100 parts of the conductive metal powder. Preferably the silicone resin has a viscosity of 500-800; and the silane compd. having three or four alkoxy functional groups is at least one selected from the group consisting of g-aminopropyltriethoxysilane, g -aminopropyltrimethoxysilane, bistriethoxysilylethane, bistrimethoxysilylethane, tetraethoxysilane and tetramethoxysilane. .