Detail of > 1624-01-7
- CAS Number:
- 1624-01-7
- Name:
Silanetetramine,N,N,N',N',N'',N'',N''',N'''-octamethyl-
- Superlist Name:
- Tetrakis(dimethylamino)silane
- Formula:
- C8H24N4Si
- Molecular Structure:

- Synonyms:
- Silanetetramine,octamethyl- (7CI,8CI,9CI);NSC 130238;Octamethylsilanetetramine;Tetra(dimethylamino)silane;Tetrakis(dimethylamido)silicon;N,N,N',N',N'',N'',N''',N'''-Octamethylsilanetetramine;
- Molecular Weight:
- 204.39
- EINECS:
- 216-611-2
- Density:
- 0.907 g/cm3
- Melting Point:
- 15 °C(lit.)
- Boiling Point:
- 201 °C at 760 mmHg
- Flash Point:
- 75.3 °C
- Appearance:
- Clear and colorless liquid
- Hazard Symbols:
C- Risk Codes:
- 14-20/21/22-34
- Safety:
- 26-36/37/39-43-45Details
- Transport Information:
- UN 2920 8/PG 2
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Reference
- Deposition method of ternary films
- All Rights Reserved. Deposition method of ternary films. Dussarrat, Christian; Yanagita, Kazutaka; Gatineau, Julien (L'Air Liquide, Societe Anonyme a Directoire et Conseil de Surveillance pour l'Etude et l'Exploitation des Procedes Georges Claude, Fr.). PCT Int. Appl.Several reagents with their cas registry numbers 15112-89-7 and 1624-01-7 are used here. WO 2007000186 A1 4 Jan 2007, 41pp. DESIGNATED STATES: W: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW; RW: AT, BE, BF, BJ, CF, CG, CH, CI, CM, CY, DE, DK, ES, FI, FR, GA, GB, GR, IE, IS, IT, LU, MC, ML, MR, NE, NL, PT, SE, SN, TD, TG, TR. (English). (World Intellectual Property Organization). CODEN: PIXXD2. APPLICATION: WO 2005-EP8196 29 Jun 2005. DOCUMENT TYPE: Patent CA Section: 75 (Crystallography and Liquid Crystals) Section cross-reference(s): 76 This invention describes a method for producing a metal-contg. film by introducing a metal source which does not contain metal-C or metal-N-C s-bonds (for example, TaCl5×SEt2), a Si precursor (for example, SiH(NMe2)3 or (SiH3)3N), a nitrogen precursor such as NH3, a C source such as monomethylamine or ethylene and a reducing agent (for example, H2) into a CVD chamber and reacting those at the surface of a substrate to produce metal contg. films in a single step. .
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