Reference

Flame-resistant polymer compositions

Flame-resistant polymer compositions. Clubley, Brian George; Davis, Boyce Ian David; Hyde, Thomas Gerald; Lamb, Frank; Randell, Donald Richard (Ciba-Geigy A.-G., Switz.).There are some reagents like 64675-28-1 is used in this study. Ger. Offen. DE 2708447 8 Sep 1977, 81 pp. (German). (Germany). CODEN: GWXXBX. CLASS: IC: C08K005-52. PRIORITY: GB 76-9072 6 Mar 1976. DOCUMENT TYPE: Patent CA Section: 36 (Plastics Manufacture and Processing) Section cross-reference(s): 25 4,4'-Bis(hydroxymethyl)biphenyl (I) [1667-12-5], 4,4'-bis(methoxymethyl)biphenyl [3753-18-2], 1,5-bis(hydroxymethyl)naphthalene [54835-54-0], oligomers of HCHO and naphthalene, and similar compds. were used to increase the effectiveness of P-contg. compds., such as (PhO)3PO [115-86-6] and tris(2,3-dibromopropyl) phosphate [126-72-7], as fireproofing agents in polystyrene [9003-53-6], styrene copolymers, polyoxyphenylenes, polycarbonates, polyesters, etc. Thus, a mixt. of polystyrene 100, I 7.5, and (PhO)3PO 18.5 parts had limiting O index 31.6%, compared with 22.9% without the I. .

Epoxy resins, their compositions, and cured products thereof with good heat resistance, water resistance, and mechanical strength

Epoxy resins, their compositions, and cured products thereof with good heat resistance, water resistance, and mechanical strength. Akatsuka, Yasumasa; Kuboki, Kenichi; Shimamura, Yoshiro; Morita, Hiromi; Oono, Hiroaki (Nippon Kayaku Kk, Japan). Jpn. Kokai Tokkyo Koho JP 08239449 A2 17 Sep 1996 Heisei, 7 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: ICM: C08G059-24.Some commonly used reagents like 1667-12-5 and 183990-18-3 are used in this experiment. ICS: C08G059-06. APPLICATION: JP 1995-68953 3 Mar 1995. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) Section cross-reference(s): 25 The compns. contain epoxy resins I [n = pos. no. (av.); P, Q = halo, C1-8 alkyl, aryl; each P and Q may differ; G = glycidyl; X = H, glycidyl; X may differ; 0-95% of X = glycidyl], hardeners, and optional cure accelerators. Thus, reaction of 211 parts II and 370 parts epichlorohydrin in DMSO in the presence of NaOH and further treatment of the product in MIBK in the presence of NaOH gave an epoxy resin I (n = 0.05, P = Me, all of Q, X = H) (epoxy equiv. 279 g/equiv), 100 parts of which was kneaded with 38.0 parts phenol novolak, transfer molded, and cured to give test pieces showing glass transition temp. 159°, water absorption 0.85%, and bending strength 13.4 kg/mm2. .