Detail of "1745-89-7"

Reference

Heat-resistant thermosetting epoxy resins

Heat-resistant thermosetting epoxy resins. (Ciba-Geigy A.-G., Switz.). Japan. Kokai JP 52154897 22 Dec 1977 Showa, 11 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C08G059-40. PRIORITY: CH 76-7747 17 Jun 1976. DOCUMENT TYPE: Patent CA Section: 36 (Plastics Manufacture and Processing) A heat-resistant thermosetting epoxy resin compn. is prepd., contg. 4,4'-bis(maleimido)diphenylmethane (I) [13676-54-5] and an allyl-substituted epoxide. Thus, a mixt. of 228 g bisphenol A [80-05-7], 82.5 g NaOH, 1 L PrOH, and 200 mL allyl chloride [107-05-1] was refluxed 3 h and stripped to give bisphenol A diallyl ether [3739-67-1], which was mixed with a diethylene glycol monoether and heated at 200-5° (Claisen rearrangement), giving o,o'-diallylbisphenol A (II) [1745-89-7]. II was then treated with epichlorohydrin to give an epoxy resin (III) [30282-02-1], which (210.3 g) was mixed with 44.75 g I, 115.6 g hexahydrophthalic anhydride, 1 mL di-tert-Bu peroxide, and 2 mL benzyldimethylamine, giving a thermosetting compn. with improved heat resistance, compared with a compn. when bisphenol A-type resin was used instead of III.

Crosslinked polymers containing imide groups

Crosslinked polymers containing imide groups. Zahir, Sheik A.; Renner, Alfred (Ciba-Geigy A.-G., Switz.). Ger. Offen. DE 2627045 20 Jan 1977, 39 pp. (German). (Germany). CODEN: GWXXBX. CLASS: IC: C08F222-40. PRIORITY: CH 75-7988 19 Jun 1975. DOCUMENT TYPE: Patent CA Section: 36 (Plastics Manufacture and Processing) Heat-resistant polyimides were prepd. from bismaleimides and allylphenols. For example, bisphenol A [80-05-7] was treated with allyl chloride [107-05-1] in PrOH in the presence of NaOH to give bisphenol A diallyl ether [3739-67-1] which was subjected to Claisen rearrangement to give 85% O,O'-diallylbisphenol A (I) [1745-89-7]. 123-54-6 and 670-96-2 are cas registry numbers. These chemicals are also mentioned in this article. A mixt. of 358 g 4,4'-bismaleimidodiphenylmethane and 308 g I was melted at 120-50.degree./15 mm, cast in a mold at 150.degree., and heated at 150.degree. for 6 h and then at 250.degree. for 12 h to give a copolymer [62386-33-8] with wt. loss after aging 10 h at 270.degree. 2.69%, heat distortion temp. 292.degree. and >300.degree., bonding strength 15.6 and 2.05 kg/mm2, impact bending strength 17.7 and14.4 kg-cm/cm2, cold water absorption 1.12 and1.97%, dielec. loss factor tan .delta. .times. 102 at 250.degree. 0.42 and 0.22, dielec. const. 3.3 and 3.2, and sp. resistance 14 and 49 .times. 1012 .OMEGA., before and after aging 10 h at 270.degree., resp. .