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Detail of "18042-54-1"

  • MSDS Download
  • CAS Number:
  • 18042-54-1
  • Name:
  • Silanetriol, 1-phenyl-,1,1,1-triacetate

  • Molecular Structure:
  • Formula:
  • C12H14O6Si
  • Molecular Weight:
  • 282.32
  • Synonyms:
  • Silanetriol,phenyl-, triacetate (6CI,7CI,8CI,9CI);Monophenyltriacetoxysilane;Phenyltriacetoxysilane;Triacetoxyphenylsilane;
  • EINECS:
  • 241-952-9
  • Density:
  • 1.2 g/cm3
  • Boiling Point:
  • 291 °C at 760 mmHg
  • Flash Point:
  • 107.9 °C
  • Appearance:
  • Colorless or yellowish transparent liquid
  • Risk Codes:
  • 36/37/38
  • Safety:
  • 26-36/37/39 Details

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CAS No.18042-54-1 Silanetriol, 1-phenyl-,1,1,1-triacetate

PHENYLTRIACETOXYSILANE

Supplier:Shandong Wanda Organosilicon New Material Co., Ltd [ China (Mainland)]

Platinum
Supplier
ISOManufacturer 2690Integral
2690

Tel:+86-21-54177116-805/ 54302881

Address:R1318 Greenland No. 3 Lane 58 Xinjian East Rd., Minhang

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CAS No.18042-54-1 Silanetriol, 1-phenyl-,1,1,1-triacetate

PHENYLTRIACETOXYSILANE

Supplier:Hangzhou Sage Chemical Co.,Ltd [ China (Mainland)]

Platinum
Supplier
1510Integral
1510

Tel:+86-571-86818502

Address:5Fl. 501Room, Tower A, New Youth Plaza, 8 Jia Shan Road, Hangzhou, China

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CAS No.18042-54-1 Silanetriol, 1-phenyl-,1,1,1-triacetate

Supplier:Beijing zhongke expanding chemical technology Co., LTD. [ China (Mainland)]

600Integral
600

Tel:010-51600645 58608265;57131961

Address:Beijing changping area connects center north pearl tower 2 buildings

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Reference

Ring cleavage reaction between polyacetoxysilanes and epichlorohydrin
Ring cleavage reaction between polyacetoxysilanes and epichlorohydrin. Xie, Qinglan; Yang, Xueru; Wang, Suhua; Wang, Jitao (Inst.Several substances are used for example 18042-54-1 and 88439-69-4 which are their cas registry numbers. Elemental-Org. Chem., Nankai Univ., Tianjin, Peop. Rep. China). Gaodeng Xuexiao Huaxue Xuebao, 4(4), 463-8 (Chinese) 1983. CODEN: KTHPDM. ISSN: 0251-0790. DOCUMENT TYPE: Journal CA Section: 29 (Organometallic and Organometalloidal Compounds) Ring cleavage of epichlorohydrin by heating with Me2Si(OAc)2, MeSi(OAc)3, Ph2Si(OAc)2, PhSi(OAc)3, Me2Si(OAc)Ph and Me2Si(OAc)C6H4Me-p in PhMe in the presence of 5-tert-butyl-2-furanatochromium at 70° gave the corresponding RnSi(OAc)3-nR1, RnSi(OAc)2-nR12 and RSiR13 [R1 = OCH(CH2Cl)CH2OAc; R = Me, Ph.C6H4Me-p; n = 0, 1, 2]. .
Silicone coating for semiconductor devices
Silicone coating for semiconductor devices. (TDK Electronics Co., Ltd., Japan).Chemicals with cas numbers 18042-54-1 and 4253-34-3 also play role. Jpn. Kokai Tokkyo Koho JP 59014641 A2 25 Jan 1984 Showa, 4 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: H01L021-312; B05D007-24; H01L021-56; H01L021-88; H01L023-30. APPLICATION: JP 82-123914 16 Jul 1982. DOCUMENT TYPE: Patent CA Section: 76 (Electric Phenomena) The heat-resistant insulating coating for semiconductor devices, with high d. and improved resistance to peel-off, is applied by using a soln. contg. organosiloxane oligomer which will give a Si compd. in the form of (RSiO3/2)n after sintering. In this compd., R is a hydrocarbon radical and n is an integer >2. .
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