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Detail of > 19783-14-3

  • CAS Number:
  • 19783-14-3
  • Name:
  • Lead hydroxide(Pb(OH)2)

  • Formula:
  • H2O2 Pb
  • Molecular Structure:
  • Synonyms:
  • Leaddihydroxide; Lead hydroxide; Lead(2+) hydroxide; Lead(II) hydroxide
  • Molecular Weight:
  • 241.21
  • Density:
  • g/cm3
  • Boiling Point:
  • 100°Cat760mmHg
  • Flash Point:
  • °C
  • Safety:
  • RIDADR 2291
    HazardClass 6.1(b)
    PackingGroup III
    Details
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CAS No. 

19783-14-3 Lead hydroxide(Pb(OH)2)

Assay:98%
Lead hydroxide, Pb(OH)2
China (Mainland)   1400
  • Tel:+86-10-6156.6641
  • Address:Suite 2-E051, BPE, No.1 NongLin Rd., FangShan, Beijing,
Min. Order:kg-100kgs Kilogram

CAS No. 

19783-14-3 Lead hydroxide(Pb(OH)2)

United Kingdom  
  • Tel:+(44) 1492 539 645
  • Address:28 Wynnstay Road, Colwyn Bay. Conwy. LL29 8NB. United Kingdom

CAS No. 

19783-14-3 Lead hydroxide(Pb(OH)2)

United States   2
  • Tel:1-800-248-2436 / 1-203-932-2489
  • Address:139 ALLINGS CROSSING ROAD, WEST HAVEN CT 06516 (USA)

CAS No. 

19783-14-3 Lead hydroxide(Pb(OH)2)

Germany   2
  • Tel:+49 9402 9336 0
  • Address:Werner-von-Siemens Str. 3 D-93128 Regenstauf / Germany
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    Reference

    Prediction of chemical forms of lead in natural waters
    Prediction of chemical forms of lead in natural waters. Gurjia, Zh.; Supatashvili, G.; Chitiashvili, Z. 96500-25-3 and 19783-14-3 are cas registry numbers. These chemicals are also mentioned in this article.; Makharadze, G. (Tbilisi Gos. Univ., Tbilise, Georgia). Soobshcheniya Akademii Nauk Gruzii, 151(3), 410-413 (Russian) 1995 Nauka. CODEN: SANGEF. DOCUMENT TYPE: Journal CA Section: 61 (Water) A computer program has been developed for calcns. of the ratio of coexisting forms of lead (PbOH+, Pb(OH)2, PbHCO3, Pb(HCO3)2, PbSO4) in natural waters using IBM PC/AT-286. It was shown that fulvic acid and hydroxy complexes predominate in surface fresh waters. .
    Epoxy resin compositions for laser marking
    Epoxy resin compositions for laser marking. Sasai, Shoji (Sumitomo Bakelite Co., Ltd.; Sumitomo Durez Co., Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 04028759 A2 31 Jan 1992 Heisei, 4 pp. (Japan). CODEN: JKXXAF. CLASS: ICM: C08L063-00. ICS: C08K003-22; C08K005-09; H01L023-29; H01L023-31. APPLICATION: JP 90-132644 24 May 1990. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) Section cross-reference(s): 76 The title compns., useful as elec. insulation on elec. and electronic devices, contain Cu(II) oxalate (I) and Pb compds. Thus, a mixt. of bisphenol A epoxy resin 50, I (av. diam. 15 mm) 5, powd. cryst. SiO2 50, 2-methylimidazole 1, and Pb(OH)2 1 part, when cured, had dielec. breakdown voltage 23 kV/mm and good laser markability.Except for chemicals metioned above, 814-91-5 and 19783-14-3 are also used. .

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