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Detail of "2131-64-8"

  • CAS Number:
  • 2131-64-8
  • Name:
  • Benzenamine,4-isothiocyanato-N,N-dimethyl-

  • Molecular Structure:
  • Formula:
  • C9H10 N2 S
  • Molecular Weight:
  • 178.27
  • Synonyms:
  • Isothiocyanicacid, p-(dimethylamino)phenyl ester (7CI,8CI); Aniline,p-isothiocyanato-N,N-dimethyl- (8CI); (4-Isothiocyanatophenyl)dimethylamine;4-(Dimethylamino)phenyl isothiocyanate; 4-(N,N-Dimethylamino)phenylisothiocyanate; NSC 196179; p-(Dimethylamino)phenyl isothiocyanate;p-Isothiocyanato-N,N-dimethylaniline
  • Density:
  • 1.04g/cm3
  • Melting Point:
  • 69 °C
  • Boiling Point:
  • 152 °C
  • Flash Point:
  • 135.8°C
  • Hazard Symbols:
  • Risk Codes:
  • 23/24/25-36/37/38
  • Safety:
  • A poison by inhalation. When heated to decomposition it emits toxic vapors of NOx and SOx. Details

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Reference

A laboratory study of the biodeterioration of industrial materials and its prevention by fungicides
A laboratory study of the biodeterioration of industrial materials and its prevention by fungicides. V. Adhesives. Zemanova, M. (Fac. Sci., Komensky Univ., Bratislava, Czech.). Acta Fac. Rerum Nat. Univ. Comenianae, Microbiol., Volume Date 1984, 13, 45-51 (English) 1986. CODEN: AFCMCH. ISSN: 0374-5163. DOCUMENT TYPE: Journal CA Section: 38 (Plastics Fabrication and Uses) Section cross-reference(s): 10, 37 The resistance to mold deterioration of 4 types of adhesives, i.e. glue, dextrin (I) [9004-53-9], sodium carboxymethylcellulose (II) [9004-32-4], and neoprene rubber, under exptl. conditions (artificial mold contamination, at ~30° and high relative humidity) was investigated. The rubber adhesive was almost resistant to mold deterioration, and II was overgrown by molds to only a slight extent. However, the glue was attacked relatively extensively, and I showed no resistance to mold growth. Full protection was obtained during 75 days of the expt.In this experiment, several chemicals are used like 87-86-5 and 9004-32-4 by the incorporation of pentachlorophenol [87-86-5], p-bromophenylisothiocyanate [1985-12-2], p-dimethylaminophenylisothiocyanate [2131-64-8], and 1-naphthylisothiocyanate [551-06-4] in 2 or 5% concn. per dry wt. of adhesive. .
A laboratory study of the biodeterioration of industrial materials and its prevention by fungicides
A laboratory study of the biodeterioration of industrial materials and its prevention by fungicides. VI. Poly(vinyl chloride). Zemanova, M.; Drobnicova, I. (Fac. Sci., Komensky Univ., Bratislava, Czech.). Acta Fac. Rerum Nat. Univ. Comenianae, Microbiol.Several reagents with their cas registry numbers 137-30-4 and 2131-64-8 are used here., Volume Date 1984, 13, 53-60 (English) 1986. CODEN: AFCMCH. ISSN: 0374-5163. DOCUMENT TYPE: Journal CA Section: 37 (Plastics Manufacture and Processing) Section cross-reference(s): 10, 38 The resistance to mold deterioration of plasticized PVC [9002-86-2] cladding on Al alloy or steel cans under exptl. conditions (artificial mold contamination at ~30° and high relative humidity) was investigated. Whereas the used sticking interlayer was resistant to mold attack, the PVC layer was contaminated extensively. Of 7 tested fungicides, the highest efficiency was exhibited by Cu 8-quinolinolate [10380-28-6] in 0.5% concn. per wt. of plastisol (added just before gelation) which fully protected the PVC layer against mold overgrowth. The protected PVC layer was adsorbed completely to the metal and could not be easily peeled off. Zn dimethyldithiocarbamate [137-30-4] (>1% concn.) completely eliminated the mold growth and simultaneously caused a blooming in the PVC layer. Tetramethylthiuramdisulfide [137-26-8] (170 concn.) and p-bromobenzylisothiocyanate [2076-56-4] and p-dimethylaminophenylisothiocyanate [2131-64-8] (both in 2% concn.) caused a marked suppression of mold growth on the PVC layer. .
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