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| CAS No.: | 22205-45-4 |
|---|---|
| Name: | COPPER(I) SULFIDE |
| Article Data: | 548 |
| Molecular Structure: | |
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| Formula: | Cu2S |
| Molecular Weight: | 159.158 |
| Synonyms: | Cuprous sulfide;Cuprous sulfide (Cu2S);Dicopper monosulfide;Dicopper sulfide; |
| EINECS: | 244-842-9 |
| Density: | 5.6 g/mL at 25 °C(lit.) |
| Melting Point: | 1100 °C |
| Solubility: | Slightly soluble in hydrochloric acid, ammonium hydroxide. Insoluble in water. |
| Risk Codes: | 20/21/22-40 |
| Safety: | 7-22-36/37/39 |
| PSA: | 25.30000 |
| LogP: | 0.64320 |
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| Conditions | Yield |
|---|---|
| decompn. under argon at about 800 K; | A 100% B 100% C 100% |
| Conditions | Yield |
|---|---|
| In water byproducts: H2SO4; pptn. of Cu2S (99.3%) and formation of FeSO4 and H2SO4 by reaction of 5%ic CuSO4- soln. with FeS2 at 200 °C in presence of quartz; quartz prevents formation of Fe2O3, Cu2O and CuS as by-products; formation of CuS with higher per cent FeS2;; | A 99.3% B n/a |
| In water byproducts: H2SO4; pptn. of Cu2S (99.3%) and formation of FeSO4 and H2SO4 by reaction of 5%ic CuSO4- soln. with FeS2 at 200 °C in presence of quartz; quartz prevents formation of Fe2O3, Cu2O and CuS as by-products; formation of CuS with higher per cent FeS2;; | A 99.3% B n/a |
| Conditions | Yield |
|---|---|
| In water for 1h; Sonication; | 91% |
| In ethanol Cu acatate and thiourea dissolved in abs.EtOH, stirred for 10 min, dip coated onto glass substrate, heated at 200°C for 10 min (several cycles), heated at 200°C for 60 min; |
- 22205-45-4
copper(I) sulfide
| Conditions | Yield |
|---|---|
| In neat (no solvent) annealing with Cu-filings;; | |
| In neat (no solvent) annealing with Cu-filings;; |
| Conditions | Yield |
|---|---|
| With hydrogen sulfide In neat (no solvent) on passing over H2O-vapor at about 450°C in presence of excess H2S;; |
| Conditions | Yield |
|---|---|
| In hydrogenchloride complete decompn.;; | |
| In hydrogenchloride complete decompn.;; |
A
- 22205-45-4
copper(I) sulfide
B
- 7757-83-7
sodium sulfite
| Conditions | Yield |
|---|---|
| In water at boiling; |
- 22205-45-4
copper(I) sulfide
| Conditions | Yield |
|---|---|
| In water quick react. with powdered Cu; | |
| In water slow react. at room temp., fast react. on boiling;; | |
| In water slow react. at room temp., fast react. on boiling;; | |
| In neat (no solvent) heating in vac. to about 110°C;; |
| Conditions | Yield |
|---|---|
| In water electroless thin film deposition from copper(II)/S2O3(2-) soln. (molar ratio Cu(II)/S2O3(2-)=1:2), pH ca. 5 (acetic acid), bath temp. 50°C;; rinsed with water, air dried; Rutherford back scattering anal., scanning electron microscopy, X-ray diffraction; |
- 534-13-4
N,N-dimethylthiourea
- 22205-45-4
copper(I) sulfide
| Conditions | Yield |
|---|---|
| In water aq. soln. of CuCl2*5H2O, dimethylthiourea and Na2S2O3 prepd. in deionized H2O, mixed, pH=2.3 at 70 °C, deposition time 3.5 h; |
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Consensus Reports
Copper and its compounds are on the Community Right-To-Know List. Reported in EPA TSCA Inventory. EPA Genetic Toxicology Program.
Standards and Recommendations
ACGIH TLV: TWA (fume) 0.2 mg/m3; (dust, mist) 1 mg(Cu)/m3
Specification
The Copper(i) sulfide, with its cas registry number 13494-80-9 powder, has the product categories which are Inorganics; Chalcogenides; Materials Science; Metal and Ceramic Science.
The characteristics of this chemical are as follows: (1)#H bond acceptors: 0; (2)#H bond donors: 0; (3)#Freely Rotating Bonds: 0; (4)Polar Surface Area: 0; (5)Enthalpy of Vaporization: 18.67 kJ/mol; (6)Vapour Pressure: 12600 mmHg at 25°C; (7)Exact Mass: 157.831273; (8)MonoIsotopic Mass: 157.831273; (9)Topological Polar Surface Area: 1; (10)Heavy Atom Count: 3.
When you are dealing with this chemical, you should be very careful. It is harmful if by inhalation, in contact with skin and if swallowed and may have limited evidence of a carcinogenic effect. Therefore, you should wear suitable protective clothing, gloves and eye/face protection. Then keep container tightly closed. Do remember not to breathe dust.
Additionally, you could convert the following datas into the molecular structure:
(1)Canonical SMILES: [S-2].[Cu+].[Cu+]
(2)InChI: InChI=1S/2Cu.S/q2*+1;-2
(3)InChIKey: AQMRBJNRFUQADD-UHFFFAOYSA-N