Detail of > 23128-74-7
- CAS Number:
- 23128-74-7
- Name:
Benzenepropanamide,N,N'-1,6-hexanediylbis[3,5-bis(1,1-dimethylethyl)-4-hydroxy-
- Superlist Name:
- Antioxidant 1098
- Formula:
- C40H64N2O4
- Molecular Structure:
- Synonyms:
- Hydrocinnamamide,N,N'-hexamethylenebis[3,5-di-tert-butyl-4-hydroxy- (8CI);1,6-Bis(3,5-di-tert-butyl-4-hydroxyhydrocinnamido)hexane;1,6-Bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamido]hexane;IX 1098;Irg 1098;Irganox 1090;Irganox 1098;Lowinox HD 98;N,N-Bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyl]hexamethylenediamine;N,N'-Hexamethylenebis(3,5-di-tert-butyl-4-hydroxyhydrocinnamamide);N,N'-Hexamethylenebis(3,5-di-tert-butyl-4-hydroxyhydrocinnamide);N,N'-Hexamethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide];TTAD;
- Molecular Weight:
- 636.96
- EINECS:
- 245-442-7
- Density:
- 1.021g/cm3
- Melting Point:
- 156-161 °C
- Boiling Point:
- 740.1 °C at 760 mmHg
- Flash Point:
- 401.4 °C
- Deleted CAS:
- 64082-95-7
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Reference
- Heat-resistant polyamide compositions
- Heat-resistant polyamide compositions. Yamamoto, Akinori; Noyori, Masaru; Shimamura, Masaharu; Tsuda, Yoshizo (Toray Industries, Inc., Japan). Japan. Kokai JP 51127151 5 Nov 1976 Showa, 10 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C08L077-00. APPLICATION: JP 75-51460 30 Apr 1975. DOCUMENT TYPE: Patent CA Section: 39 (Textiles) Heat-resistant polyamide compns. with good spinnability contained Na borate [1333-73-9] or lithium borate [12676-27-6], Na phenylphosphinate (I) [4297-95-4] or tri-Ph phosphite [101-02-0], and 1,2,3-trimethyl-2,4,6-tris(3,5-di-tert-butyl-4-hydroxybenzyl)benzene (II) [1709-70-2] or N,N'-bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyl]hexamethylenedi amine [23128-74-7]. For example, 80 parts dodecamethylenediamine terephthalate, 20 parts dodecamethylenediamine isophthalate, 4.0 mol% (based on combined nylon salts) dodecamethylenediamine, 3.5 mole% benzoic acid, 0.05% Na borate, 0.1% I, 0.1% II, and 67 parts water under N were heated to 15 kg/cm2 gage and >95.degree. over 2 h, depressurized to atm. pressure over 1.5 h while heated to 305.degree., and evacuated at 600 mmHg for 20 min to give polyamide [61751-72-2] which was spun at 300-5.degree. without breakage or fluff formation and drawn 250-350% at 160.degree. to give fiber with tenacity 4.6 g/denier, elongation 29%, Young's modulus 51 g/denier, and b value (yellowness) 2.2, while the fiber heat-treated at 190.degree. for 3 min had tenacity retention 94%, elongation 52%, and b value 3.6.
- Heat-resistant polyacetal compositions
- Heat-resistant polyacetal compositions. Sugio, Akitoshi; Otsuki, Yoshiharu; Umemura, Toshikazu; Mizutani, Makoto (Mitsubishi Gas Chemical Co., Inc., Japan). Japan. Kokai JP 52051443 25 Apr 1977 Showa, 3 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C08L059-00. APPLICATION: JP 75-127808 23 Oct 1975. DOCUMENT TYPE: Patent CA Section: 36 (Plastics Manufacture and Processing) I [Z = (CH2)6 (II) [23128-74-7], (CH2)4 [63555-49-7], p-C6H4 [58306-82-4]] were heat stabilizers for polyoxymethylenes. For example, polyoxymethylene diacetate contg. 0.5% II had heat loss rate (at 222.degree.) 0.015%/min, compared with 0.85 for a control contg. urea in place of II.
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