Detail of "2399-48-6"

Reference

Photocurable coating materials

Photocurable coating materials. (Toyobo Co., Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 58091714 A2 31 May 1983 Showa, 9 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C08F283-02. ICA: C08G063-02; C09D005-00; C09D011-02. APPLICATION: JP 81-189491 25 Nov 1981. DOCUMENT TYPE: Patent CA Section: 42 (Coatings, Inks, and Related Products) Photocurable coating materials contain radically polymerizable monomers and satd. polyesters which are sol. in those monomers and have benzophenone groups in the polymer chains. Thus, a mixt. of di-Me terephthalate 194, di-Me isophthalate 194, ethylene glycol 193, 1,6-hexanediol 146, and Zn(OAc)2.2H2O 0.18 part was heated gradually to 220°, kept 2 h at 220°, treated with 16.3 parts 4,4'-carbonylbis[N-(2-hydroxyethyl)phthalimide] at 220° for 30 min, and heated 1 h at 260° and 10 mm to give copolymer (I) [88050-01-5]. A compn. of the I 40, tetrahydrofurfuryl acrylate [2399-48-6] 30, ethoxylated bisphenol A diacrylate 30, and 4-methoxyphenol 0.01 part having viscosity 162 P at 25° was applied to a poly(ethylene terephthalate) film and UV irradiated 8 s with a 5.6-kW Hg lamp to form a 15-m coating having pencil hardness H and good adhesion to the film.

Printed circuits

Printed circuits. (Toyobo Co., Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 58106893 A2 25 Jun 1983 Showa, 9 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: H05K003-12. APPLICATION: JP 81-205721 18 Dec 1981. DOCUMENT TYPE: Patent CA Section: 38 (Plastics Fabrication and Uses) Section cross-reference(s): 42, 74, 76 Elec. circuits with high cond. and good adhesion to circuit boards are manufd. rapidly without heating by printing or coating and then photochem. curing solns.Several substances with their cas registry numbers 7440-22-4 and 66027-04-1 may be metioned in this study. of satd. copolyesters, epoxy-(meth)acrylate adducts, elec. conductive compds., and photosensitizers in polymerizable liqs. Thus, ethylene glycol-1,6-hexanediol-isophthalic acid-terephthalic acid copolymer [66027-04-1] 40, tetrahydrofurfuryl acrylate [2399-48-6] 30, bisphenol A-ethylene oxide (1:4) adduct diacrylate [64401-02-1] 30, and hydroquinone thermal polymn. inhibitor 0.01 part were mixed at 80°, and 10 parts of the resulting compn. were combined with bisphenol A epoxy resin acrylate [53814-24-7] 5, trimethylolpropane triacrylate [15625-89-5] 5, powd. Ag 70, 2-hydroxy-2-methylpropylphenone [7473-98-5] 6, and acrylic slip agent 5 parts to obtain a compn. which was screen printed onto a 125-m polyester film and cured under a high-pressure Hg lamp to obtain a printed circuit having conductor leads 12 m thick, with pencil hardness H, excellent adhesion and resistivity 6 ′ 10-3 W-cm. .