CAS No.2461-46-3,Oxirane,2,2'-[[1,1'-biphenyl]-4,4'-diylbis(oxymethylene)]bis- Suppliers

CAS Number:
2461-46-3
Name:
Oxirane,2,2'-[[1,1'-biphenyl]-4,4'-diylbis(oxymethylene)]bis-
Superlist Name:
4,4'-Bis(2,3-epoxypropoxy)biphenyl
Formula:
C18H18 O4
Molecular Structure:
Synonyms:
Biphenyl,4,4'-bis(2,3-epoxypropoxy)- (7CI,8CI); 4,4'-Biphenyldiol diglycidyl ether;4,4'-Bis(2,3-epoxypropoxy)biphenyl; 4,4'-Bisglycidyloxybiphenyl;4,4'-Dihydroxybiphenyl diglycidyl ether; Biphenyl-4,4'-diglycidyl ether;p,p'-Bisphenol diglycidyl ether; p-(2,3-Epoxypropoxy)diphenyl
Molecular Weight:
298.33312
EINECS:
219-556-2
Density:
1.226g/cm³
Boiling Point:
473.6°Cat760mmHg
Flash Point:
171.5°C

Total:1 Page 1 of 1 1

Please post your buying leads,so that our qualified suppliers will soon contact you!
*Required Fields

Crystalline epoxy resin semiconductor sealants: Crystalline epoxy resin semiconductor sealants. Nakatsuka, Hiroshi; Mazaki, Shiro; Kawamoto, Norio; Saito, Kiyoshi (Nitto Electric Industrial Co., Ltd., Japan). 107817-69-6 and 2461-46-3 are also occured in this study. Jpn. Kokai Tokkyo Koho JP 61259552 A2 17 Nov 1986 Showa, 4 pp. (Japan) CODEN: JKXXAF. CLASS: ICM: H01L023-30. ICS: C08G059-24. APPLICATION: JP 85-102302 14 May 1985. DOCUMENT TYPE: Patent CA Section: 38 (Plastics Fabrication and Uses) Section cross-reference(s): 76 Granular polymer compns. with good melt fluidity and fast hardening, useful for sealing semiconductor devices, comprise cryst. epoxy resins (contg. ￡20% oligomers), inorg. fillers, and hardeners. 4,4'-Bis(2",3"-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl (I), fused silica, A 186 (silane coupling agent), and carbon black were mixed at 95-100°, kneaded with a novolac and 2-undecylimidazole, and cooled and pulverized to obtain a free-flowing compn. (flow distance/powder thickness on inclined steel sheet >25), which when applied to IC chips at 150° gave sealed devices showing no cracks after 10 thermal cycles from -10 to +150°, in contrast to chips sealed with a similar compn. using a bisphenol A epoxy resin with epoxy equiv. wt. 650. instead of the I and novolak. .

[Hangzhou]86-571-85317600,85317603,85317620