Reference

Crystallization in polymer films: control of morphology and kinetics of an organic dye in a polysilicone matrix

Crystallization in polymer films: control of morphology and kinetics of an organic dye in a polysilicone matrix. Davey, Roger J.; Black, Simon N.; Goodwin, Alan D.; Mackerron, Duncan; Maginn, Steven J.; Miller, Emma J. (Dep.Some commonly used reagents like 31900-57-9 and 24979-74-6 are used in this experiment. Chem. Eng., UMIST, Manchester M60 1QD, UK). Journal of Materials Chemistry, 7(2), 237-241 (English) 1997 Royal Society of Chemistry. CODEN: JMACEP. ISSN: 0959-9428. DOCUMENT TYPE: Journal CA Section: 41 (Dyes, Organic Pigments, Fluorescent Brighteners, and Photographic Sensitizers) The successful selection, design and synthesis of additives for the control of nucleation and crystn. of a red anthraquinone based dye is described. This procedure is based on the crystal structure and morphol. of soln. grown crystals, and in this study the possibility of using the same approach to control crystn. within an amorphous polymeric matrix is explored. .

Low-stress potting resin compositions for semiconductor devices

Low-stress potting resin compositions for semiconductor devices. Enoki, Hisafumi; Suzuki, Kenichi; Okubo, Hikari (Sumitomo Bakelite Co., Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 04013714 A2 17 Jan 1992 Heisei, 7 pp. (Japan). CODEN: JKXXAF. CLASS: ICM: C08G059-40. ICS: C08G059-62; C08L063-00; H01L023-29; H01L023-31. APPLICATION: JP 90-115064 2 May 1990. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) Section cross-reference(s): 76 The title compns. having high glass transition temp. and good moisture resistance contain (A) propargyl etherated phenolic resin and/or hydroxystyrene polymer, (B) polysiloxane X(SiR2O)nSiR2X (I, X = H, 2-aminopropyl, 3-glycidoxypropyl, vinyl, allyl; R = Me, Ph, X; n = 1-100), and (C) epoxy resin. Nikanol P-100 (phenolic arom. hydrocarbon resin) was propargylated (phenolic OH group conversion 98%), and the resulting product 100, I (X = H; R = Me) 30, and 1% chloroplatinic acid soln. in iso-PrOH 0.5 part were heated in 100 parts toluene at 80° for 2 h then at 180°/20 mm-Hg for 4 h to give a modified resin (II). A compn. from II 67, EOCN 102 epoxy resin 22, PR-51470 epoxy hardener 11, Ph3P 1.0, SiO2 400, an aminosilane 3, Zn stearate 3, and carbon black 3 parts gave a cured specimen with bending strength 17.1 (4.7 kg/mm2 at room temp. (260°), bending modulus 1210 (480) kg/mm2, glass transition temp. 242°, moisture absorption 0. 9003-35-4 and 24979-74-6 are just another two chemicals used in this study.8%, and good solder heat resistance. .