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Detail of > 25038-81-7

  • MSDS Download
  • CAS Number:
  • 25038-81-7
  • Name:
  • Poly(pyromellitic dianhydride-co-4,4'-oxydianiline)

  • Formula:
  • (C12H12N2OC10H2O6)n
  • Molecular Structure:
  • Synonyms:
  • 4,4'-Diaminodiphenyl oxide-pyromellitic dianhydride copolymer
  • Density:
  • 1.04
  • Flash Point:
  • 59 ºC
  • Hazard Symbols:
  • Risk Codes:
  • R45;R65   
  • Transport Information:
  • UN 1866
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CAS No. 

25038-81-7 Poly(pyromellitic dianhydride-co-4,4'-oxydianiline)

We could supply belows: 1.polyimide film with thickness: 1mil,2mil,3mil,5mil, etc.,widely used in electrical and electronic industry. 2. fep polyimide film made of polyimide film coated by F46 on single side or double sides with thickness: 0.0375mm-0.12mm, widely used in elec
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    Reference

    Photosensitive polymer compositions
    Photosensitive polymer compositions. (Hitachi, Ltd.; Hitachi Chemical Co., Ltd. 64427-99-2 and 24980-39-0 are also occured in this study., Japan). Jpn. Kokai Tokkyo Koho JP 58160320 A2 22 Sep 1983 Showa, 8 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C08G073-10; C08F002-46. APPLICATION: JP 82-42778 19 Mar 1982. DOCUMENT TYPE: Patent CA Section: 38 (Plastics Fabrication and Uses) Section cross-reference(s): 37, 74 Photoresist compns. contain polyamic acids or their NH4 salts, unsatd. amines, and optionally photosensitizers. Thus, a polyamic acid [25038-81-7] (viscosity 60 P) was prepd. from pyromellitic dianhydride 109, oxydianiline 100, and N-methylpyrrolidinone 1791 g. This soln. (20 g) was mixed with 1.9 g 2-(dimethylamino)propyl sorbate [89664-26-6] to give a UV photoresist for Si wafers. .
    Preparation of polyimide varnish
    Preparation of polyimide varnish. (Toray Industries, Inc., Japan). Jpn. Kokai Tokkyo Koho JP 58189260 A2 4 Nov 1983 Showa, 4 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C09D003-49; C08G073-10; C08L079-08. APPLICATION: JP 82-71333 30 Apr 1982. DOCUMENT TYPE: Patent CA Section: 42 (Coatings, Inks, and Related Products) A tetracarboxylic acid dianhydride is heated with a diamine in a solvent to give a polyamic acid which is heated further to give a polyimide suspension. The same or a different combination of dianhydride and diamine is then heated in the suspension to form a sol. polyamic acid in addn. to the polyimide, giving a binder dispersion suitable for screen-printing inks. Thus, a 120.1-124.3 diaminodiphenyl ether-pyromellitic dianhydride copolymer [25038-81-7] polyimide suspension was prepd. in 695.6 g N-methyl-2-pyrrolidinone by heating the comonomers at £150°. To the suspension were added 94.3 g diaminodiphenyl ether and 139.3 g benzophenone tetracarboxylic dianhydride and the mixt. was heated at 70° to give a polyamic acid [64427-99-2]-contg. 24980-39-0 and 64427-99-2 are just another two chemicals used in this study. varnish of viscosity 1000 ± 200 P. .

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