Detail of "25085-75-0"

Reference

Epoxy resin composition for printed circuit boards and laminated board produced

Epoxy resin composition for printed circuit boards and laminated board produced.Several substances are used for example 25085-75-0 which is its cas registry number. Arata, Michitoshi; Sase, Shigeo; Takano, Nozomu; Fukuda, Tomio ( Hitachi Chemical Company, Ltd.; Arata, Michitoshi; Sase, Shigeo; Takano, Nozomu; Fukuda, Tomio, Japan). PCT Int. Appl.Chemicals with cas numbers 822-06-0 and 23996-25-0 also play role. WO 9701591 A1 16 Jan 1997, 16 pp. DESIGNATED STATES: W: CN, JP, KR, SG, US; RW: AT, BE, CH, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE. (Japanese). (World Intellectual Property Organization). CODEN: PIXXD2. CLASS: ICM: C08G059-20. ICS: C08L063-04; C08L061-12; B32B027-38. APPLICATION: WO 1996-JP1707 20 Jun 1996. PRIORITY: JP 1995-160671 27 Jun 1995. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) An epoxy resin compn. for printed wiring boards comprises as the essential components (a) an epoxy resin obtained by epoxidizing a condensation product of a phenol with hydroxybenzaldehyde, (b) a condensation product of bisphenol A with formaldehyde, (c) a flame retarder, and (d) a curing accelerator. The compns. are useful in laminated board for printed wiring boards which has low hygroscopicity, high heat resistance, good high-temp. characteristics, high resistance against electrolytic corrosion, high resistance against color change due to heating, and high Tg. A compn. contained PhOH-salicylaldehyde copolymer epoxy resin, bisphenol A novolak resin, tetrabromobisphenol A, and 1-cyanoethyl-2-ethyl-4-methylimidazole. ..