Reference

Dielectric and mechanical relaxation in hot-hardening epoxy compounds

Dielectric and mechanical relaxation in hot-hardening epoxy compounds. Kessenikh, R. M.; Petrov, A. V. (Tomsk. Politekh. Inst. im. Kirova, Tomsk, USSR). Sb.Chemicals with cas numbers 84-74-2 and 26590-20-5 also play role. Ref. - Vses. Konf. "Fiz. Dielektr. Perspekt. Ee Razvit.", Meeting Date 1973, Volume 2, 95-6. Edited by: Koikov, S. N.; Semushkin, G. B. Leningr. Politekh. Inst.: Leningrad, USSR. (Russian) 1974. CODEN: 34RHA7. DOCUMENT TYPE: Conference CA Section: 36 (Plastics Manufacture and Processing) The kinetics of mech. and dielec. relaxation of crosslinked epoxy resins are detd. by the intermol. interaction at temps. in the vicinity of the softening point of the polymer. Compns. contg. ED 6 [9083-76-5] crosslinked with methyltetrahydrophthalic anhydride (I) [26590-20-5] and modified with dibutyl phthalate [84-74-2] and DEG 1 [25928-94-3] were examd. and the activation energies of the mech. and dielec. relaxations were detd. The activation energy of mech. and dielec. relaxation of crosslinked ED 6 was 50 and 42 kcal/mol., resp., and the mech. relaxation time was 4-fold higher than the dielec. The addn. of plasticizers decreased both the relaxation times. The dielec. relaxation was related to the thermal motion of the CO groups of I and the mech. relaxation was detd. by the energy of intermol. interaction in the rigid polymer chain. .

Physicomechanical properties of multicomponent epoxy polymers

Physicomechanical properties of multicomponent epoxy polymers. Lipskaya, V. A.; Voloskov, G. A.; Solonitsyna, V. A.; Goncharova, O. V.; Voloshkin, A. F. (USSR). Plast. Massy, (10), 15-17 (Russian) 1983. CODEN: PLMSAI. ISSN: 0554-2901. DOCUMENT TYPE: Journal CA Section: 37 (Plastics Manufacture and Processing) The effect of the diluent, plasticizer, and mixt. compn. on the physicomech.Several substances with their cas registry numbers 58856-59-0 and 37099-12-0 may be metioned in this study. properties of multicomponent epoxy resins for sealing materials and adhesives was studied. Mixts. of (1) epoxy resins UP652 [77642-29-6], ED-8 [25068-38-6], UP 563 [52284-99-8], or diglycidyl phthalate (DGF 25) [37099-12-0]; (2) crosslinking agents m-phenylenediamine [108-45-2], Diamet Kh [101-14-4], or UP5-159 [58856-59-0]; (3) diluents UP 649 [61419-64-5], E 181 [39310-19-5], condensation product of 2,5-dichloraniline resin with sebacic acid polyanhydride, UP 5-200 [77642-30-9], or UP 5-203 [25667-63-4]; and (4) plasticizers di-Bu phthalate [84-74-2], or DEG 1, [25928-94-3] were cured under isothermal conditions. The residual stress (sr) and glass transition temp. of the polymers were detd. during curing and subsequent cooling to -60°. The physicomech. properties of the epoxy resins were improved and sr increased by addn. of diluents; the deformability and relaxation properties were improved by addn. of plasticizers. An exponential dependence for the decrease in sr vs. plasticizer content was obtained. The optimum ratio of epoxy resins with different reactivities in the multicomponent systems can be calcd. from the kinetic parameters of parallel reactions. .