Detail of "28768-32-3"

Reference

Diaminodiphenylmethane tetraglycidyl compound

Diaminodiphenylmethane tetraglycidyl compound. (Mitsubishi Petrochemical Co., Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 59013772 A2 24 Jan 1984 Showa, 7 pp. 56-81-5 and 104-76-7 are also occured in this study. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C07D303-36. APPLICATION: JP 82-123648 15 Jul 1982. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) Epichlorohydrin (I) [106-89-8] was treated with diaminodiphenylmethane (II) [101-77-9] or its derivs. in a water-miscible alc. having b.p. >120°, and the resulting adduct was dehydrochlorinated with an alkali metal hydroxide to give liq. polyepoxide curable to heat-resistant plastics. Thus, II 30, I 224, and ethylene glycol [107-21-1] 30 parts were heated at 50° for 3 h, treated over 1 h with 60 parts 48% aq. NaOH at <50°, and concd. in vacuo at 60°. The residue was stirred with 200 parts MEK and 300 parts water at 70°, freed from aq. layer, washed twice with water, and concd. in vacuo to give 240 parts N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane [28768-32-3] having epoxy equiv. 115, viscosity (25°) 2800 P, and Gardener color 2-3. A mixt.of this product and diaminodiphenyl sulfone in ratio was defoamed at 140° and cured at 180° for 1 h and then 190° for 3 h in a mold to give a cured specimen having tensile modulus 38,000 kg/cm2. .

The cure reactions, network structure and mechanical response of diaminodiphenyl sulfone cured tetraglycidyl 4,4'-diaminodiphenyl methane epoxies

The cure reactions, network structure and mechanical response of diaminodiphenyl sulfone cured tetraglycidyl 4,4'-diaminodiphenyl methane epoxies. Mones, Eleno T.; Morgan, Roger J. (Lawrence Livermore Natl. Lab., Univ. California, Livermore, CA 94550, USA). Polym. Mater. Sci. Eng., 51, 430-5 (English) 1984. CODEN: PMSEDG. DOCUMENT TYPE: Journal CA Section: 37 (Plastics Manufacture and Processing) To consume all of the epoxy groups in the system tetraglycidyl 4,4'-diaminodiphenylmethane (I) [28768-32-3] contg. diaminodiphenyl sulfone (II) [80-08-0], I should contain 35% II. However, com. I contains only 20-25% II, and other reactions than amine-epoxy addn. must occur. The results of Fourier-transform IR studies are given. The rate consts. detd. show that the secondary amine-epoxy and epoxy-OH reactions at 177° are 10 times slower than the primary amine-epoxy reaction. The epoxy-epoxy reaction is ~200 times slower than the primary amine-epoxy reaction and plays an insignificant role in the overall cure. The primary amine-epoxy reaction dominates the early stages of the cure until the amine is depleted, and the epoxy-OH reaction dominates the later stages, and ~70% of the secondary amine is consumed upon 100% epoxy conversion.