Detail of "28825-96-9"

Reference

Epoxy resins and their compositions

Epoxy resins and their compositions. (Mitsui Toatsu Chemicals, Inc., Japan). Jpn. Kokai Tokkyo Koho JP 60020925 A2 2 Feb 1985 Showa, 5 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: ICM: C08G059-02. ICS: C09J003-16. APPLICATION: JP 83-126935 14 Jul 1983. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) Epoxy resins with excellent heat resistance, epoxy value 30.2 equiv/100 g, and av. mol. wt. 400-1500 are prepd. by oligomerization of triglycidyl isocyanurate (I) in the presence of an acidic catalyst. The resins are mixed with a hardener reactive with the glycidyl group to obtain thermosetting resin compns. with excellent heat resistance. Thus, 18.8 g molten PhOH [108-95-2] was added dropwise to 300 g molten crude I (epoxy value 0.96 equiv/100 g, m.p. 100°) at 140° and heated 3 h to obtain an epoxy resin (II) [28825-96-9] (epoxy value 0.35 equiv/100 g, no.-av. mol. wt. 710). Then, 95 parts II and 5 parts dicyandiamide were kneaded at 80°, pressed at 150° and 100 kg/cm2 for 60 min, and heated at 180° for 2 h to obtain a sheet, showing bending strength 158, 156, and 152 kg/mm2 at 25°, 100°, and 180°, resp., vs. 140, 69, and <10 kg/mm2, resp., for a sheet prepd. by using Epikote 834 instead of II.

Heat-resistant resin compositions

Heat-resistant resin compositions. (Hitachi Chemical Co., Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 60051709 A2 23 Mar 1985 Showa, 14 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: ICM: C08G018-34. ICS: C08G059-40. APPLICATION: JP 83-158531 30 Aug 1983. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) Section cross-reference(s): 35 Heat-resistant compns. comprise an epoxy resin, possibly a crosslinking catalyst, and an alc.-modified polyamide imide obtained by the reaction of CnH2n+1OH (n = 1-4), an arom. polyisocyanate, and a tricarboxylic acid anhydride in the presence of a dispersing stabilizer and 2 nonaq. org. liqs. which are not miscible. Thus, a mixt. of Isopar-H (I) 152, lauryl methacrylate 174.5, 2-hydroxyethyl methacrylate 25.5, a Bz2O2 paste 2 g was heated at 140° for 4 h and at 170° for 2 g to give a dispersing stabilizer (A) with 40% solids and no.-av. mol. wt. 34,000. A mixt. of MDI 75, I 150, N-methyl-2-pyrrolidone 33, A 19, and trimellitic anhydride 72 g was heated at 115° for 1 h and 125° for 3 h and treated with CH3OH to give an alc.-modified polyamide imide (B) with reduced viscosity 0.13 (DMF, 30°). A heat-resistant compn. consisted of B 20, XB 2615 [28825-96-9] 20, 2PZ-CN (1-cyanoethyl-2-phenylimidazole) [23996-12-5] 0.2 g.