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Detail of "29319-22-0"

  • CAS Number:
  • 29319-22-0
  • Name:
  • POLY(3,3',4,4'-BIPHENYLTETRACARBOXYLIC DIANHYDRIDE-CO-1,4-PHENYLENEDIAMINE),AMIC ACID

  • Molecular Weight:
  • 0
  • Synonyms:
  • POLY(3,3’,4,4’-BIPHENYLTETRACARBOXYLIC DIANHYDRIDE-CO-1,4-PHENYLENEDIAMINE),AMIC ACID;[5,5’-Biisobenzofuran]-1,1’,3,3’-tetrone,polymerwith1,4-benzenediamine;[5,5’-biisobenzofuran]-1,1’3,3’-tetrone,polymerwith1,4-benzenediamine;poly(biphenyltetracarboxylicdianhydride-co-pheny;Poly(3,3,4,4-biphenyltetracarboxylic dianhydride-co-1,4-phenylenediamine), amic acid (solution);POLY(BIPHENYLTETRACARBOXYLIC DIANHYDRIDE- CO-PHENYLENEDIAMINE), AMIC ACID (SOLN);BIPHENYL DIANHYDRIDE-P-PHENYLENEDIAMINE COPOLYMER;4,4’-biphthalic anhydride/ p-phenylenediamine copolymer
  • Density:
  • 1.07 g/mL at 25 °C
  • Boiling Point:
  • 202 °C
  • Flash Point:
  • 194 °F
  • Hazard Symbols:
  • HarmfulXn
  • Risk Codes:
  • 20/21/22-36/37/38-43-63
  • Safety:
  • 23-26-36-36/37/39 Details

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CAS No.29319-22-0 POLY(3,3',4,4'-BIPHENYLTETRACARBOXYLIC DIANHYDRIDE-CO-1,4-PHENYLENEDIAMINE),AMIC ACID

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Reference

Analysis of peeled surfaces in polyimide film/adhesive/copper foil system by ESCA
Analysis of peeled surfaces in polyimide film/adhesive/copper foil system by ESCA. Ogawa, Toshio (Kanazawa Inst. Technol., Nonoichi 921, Japan). 7440-50-8 and 29319-22-0 are also occured in this study. Anal. Sci., 7(Suppl., Proc. Int. Congr. Anal. Sci., 1991, Pt. 2), 1625-8 (English) 1991. CODEN: ANSCEN. ISSN: 0910-6340. DOCUMENT TYPE: Journal CA Section: 42 (Coatings, Inks, and Related Products) Peeled surfaces in polyimide film-adhesive-Cu foil system were analyzed by ESCA. The peaks caused by O, N, and C were noticed, and the values of O/N and N/C ratios in peeled surfaces were detd. The O/N and N/C ratios in both polyimide film and Cu foil sides were very similar to those on the surface of polyimide film before adhesion. These values were also very similar to those calcd. from the chem. structure. The O/N ratios in adhesive were very different from those in peeled surfaces. Fracture occurred within the polyimide film, i.e., cohesive fracture. .
Pentacene field-effect transistors on plastic films operating at high temperature above 100°C
Pentacene field-effect transistors on plastic films operating at high temperature above 100°C. Sekitani, Tsuyoshi; Iba, Shingo; Kato, Yusaku; Someya, Takao ( Quantum Phase Electronics Center, School of Engineering, The University of Tokyo, Bunkyo-ku, Tokyo 113-8656, Japan). Applied Physics Letters, 85(17), 3902-3904 (English) 2004 American Institute of Physics. CODEN: APPLAB. ISSN: 0003-6951. DOCUMENT TYPE: Journal CA Section: 76 (Electric Phenomena) Section cross-reference(s): 38 We have manufd. pentacene field-effect transistors on polyimide base films with polyimide gate dielec. layers, and characterized electronic performance and surface morphol. with application of heat in the temp. range 30-210°. It is found that mobility of pentacene field-effect transistors is enhanced from 0.27 to 0. 32197-39-0 and 29319-22-0 are also in the experiment.71 cm2/V×s when measurement temps. varies from 30 to 160° under light-shielding nitrogen environment. To investigate post-annealing effects, we have measured transfer curves at 30° after many heat cycles at various temps. Mobility is almost const. even after annealing at 130°, showing the excellent stability of the present device at high temps. .
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