Detail of "29690-82-2"

Reference

Phenolic resins containing unsaturated imide groups and derivatives

Phenolic resins containing unsaturated imide groups and derivatives. (Hitachi, Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 59157109 A2 6 Sep 1984 Showa, 5 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C08G008-28; H01B003-36. APPLICATION: JP 83-29456 25 Feb 1983. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) Section cross-reference(s): 38, 76 Title resins I (R = H, Me, CMe3, Ph; X = CH:CH, 2-norbornene-5,6-diyl, 1-cyclohexene-4,5-diyl, methyl-2-norbornene-5,6-diyl) are used to prep. epoxy resin compns. suitable for embedding semiconductors. Thus, a novolak epoxy resin ECN 1273 [29690-82-2], a condensation product (prepd. from phthalimidomethylphenol and hexamethylenetetramine], Ph3P, epoxysilane coupling agent KBM 403, fused quartz powder, mold-release agent Hoechst Wax E, and carbon black were mixed to give a compn. which was used to embed MOS-type LSI elements.

Phenolic resins containing imidazole rings

Phenolic resins containing imidazole rings. (Hitachi, Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 59157110 A2 6 Sep 1984 Showa, 6 pp. (Japanese). (Japan). CODEN: JKXXAF.Several reagents such as 29690-82-2 is used here. CLASS: IC: C08G008-28; H01B003-36. APPLICATION: JP 83-29457 25 Feb 1983. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) Section cross-reference(s): 38, 76 Title resins I (R, R1 = C1-17 alkyl, Ph; m = 1-10; n = 1-10; m + n < 11) are prepd. and used to make epoxy resin compns. with good resistance to moisture and thermal shock, which are suitable for embedding semiconductors and for making adhesives of high bonding strength in manuf. of Cu-clad laminates. Thus, a resin prepd. from a phenolic novolak and 2-phenyl-4,5-bis(hydroxymethyl)imidazole, novolak epoxy resin ECN 1273 [29690-82-2], epoxy silane coupling agent KBM 403, quartz powder, mold-release agent Hoechst Wax E, and carbon black were mixed to give a compn. which was used to embed MOS-type LSI elements by transfer molding. .