Detail of "3053-68-7"

Reference

Epoxy resin compositions

Epoxy resin compositions. (Matsushita Electric Works, Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 60018521 A2 30 Jan 1985 Showa, 3 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: ICM: C08G059-68. ICS: H01L023-30. APPLICATION: JP 83-125281 9 Jul 1983. DOCUMENT TYPE: Patent CA Section: 38 (Plastics Fabrication and Uses) The title compns. having long pot life and excellent moisture resistance, useful in semiconductor potting compns. and laminates, contain crosslinking agents and org. phosphine-org. boron complex curing accelerators. Thus, an epoxy resin 200, a phenolic resin crosslinking agent 100, Ph3P-Ph3B complex (I) [3053-68-7] 4, quartz glass powder 700, carnauba wax 4, carbon black 4, Sb2O3 28, and coupling agent 4 parts were mixed to obtain a compn. which retained 90% of its initial spiral flow length for 200 h at 30°, and when used to pot semiconductor devices with Al leads gave potted devices showing cumulative failure 0/40 after 500 h at 133° and 100% humidity, vs. 40 h and 10/40 using 2-phenylimidazole instead of I.