Detail of "34759-34-7"

Reference

Polymers of (meth)acrylate esters

Polymers of (meth)acrylate esters. Kawai, Hiromasa; Morinaga, Takashi; Miyazima, Hiromu; Akima, Toshio; Katoh, Mitsuharu; Hosoi, Yutaka (Hitachi Chemical Co., Ltd. , Japan). Eur. Pat. Appl. EP 141610 A2 15 May 1985, 119 pp. DESIGNATED STATES: R: DE, FR, GB, NL. (English). (European Patent Organization). CODEN: EPXXDW. CLASS: ICM: C08F020-18. ICS: B29D011-00. APPLICATION: EP 84-307292 23 Oct 1984. PRIORITY: JP 83-198743 24 Oct 1983; JP 83-205601 1 Nov 1983; JP 84-197596 20 Sep 1984. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) Section cross-reference(s): 35 I (R = H or Me) are homopolymd. or copolymd. with monomers such as (meth)acrylate esters and maleimide derivs. to prep. polymers which have high transparency, low water absorption, and glass temp. 3100° and are useful as optical elements such as lenses. Thus, tricyclo[5.2.1.02,6]dec-8-yl methacrylate (II) [34759-34-7] was prepd. by esterifying tricyclo[5.2.1.02,6]decan-8-ol [13380-89-7] with methacrylic acid. A mixt. of II 100, lauroyl peroxide 0.4, dodecyl mercaptan 0.2, H2O 270, K5P3O10 (10% aq.) 30, Na dodecylbenzenesulfonate 0.015, and Na2SO4 0.3 part was heated 2 h at 60° and 4 h at 98° to prep. a polymer [34755-33-4] having glass temp. 173°, light transmittance 91%, and water absorption (ASTM D570) 0.2%.

Epoxy resin vinyl ester-based thermosetting compositions suitable for production of smooth topcoats for printed circuit boards

Epoxy resin vinyl ester-based thermosetting compositions suitable for production of smooth topcoats for printed circuit boards. Sato, Kiyoshi; Kitamura, Kazunori (San-Ei Kagaku Co. Ltd., Japan). Eur. Pat. Appl. EP 1277798 A2 22 Jan 2003, 36 pp.In this experiment, several chemicals are used like 461-58-5 DESIGNATED STATES: R: AT, BE, CH, DE, DK, ES, FR, GB, GR, IT, LI, LU, NL, SE, MC, PT, IE, SI, LT, LV, FI, RO, MK, CY, AL, TR, BG, CZ, EE, SK. (English). (European Patent Organization). CODEN: EPXXDW. CLASS: ICM: C08L063-10. ICS: C08G059-18. APPLICATION: EP 2002-254914 12 Jul 2002. PRIORITY: JP 2001-253678 19 Jul 2001. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) Section cross-reference(s): 42, 76 A thermosetting resin compn. comprises (i) an adduct of epoxy resin with unsatd. aliph. acid, (ii) a (meth)acrylate, (iii) a radical polymn. initiator, (iv) a crystallizable epoxy resin, and (v) a latent curing agent capable of primary curing at relatively low temp. and secondary curing at relatively high temp. The thermosetting resin compn.There are some commonly used reagents with their cas registry numbers 46472-88-2 and 34759-34-7 in this article. is esp. suitable for prodn. of smooth air bubble-free topcoats for printed circuit boards. Thus, a thermosetting compn. was produced by mixing an epoxy novolak resin acrylates (100), iso-Pr acrylate (40), trimethylolpropane triacrylate (10), tricyclodecane dimethanol acrylate (100), t-Bu peroxybenzoate (10), a tetramethylbiphenyl-type epoxy resin (100), dicyandiamide (16), polydimethylsiloxane (0.1) and barium sulfate (120 parts). ..