Detail of "4297-95-4"

Reference

Heat-resistant polyamide compositions

Heat-resistant polyamide compositions. Yamamoto, Akinori; Noyori, Masaru; Shimamura, Masaharu; Tsuda, Yoshizo (Toray Industries, Inc., Japan). Japan. Kokai JP 51127151 5 Nov 1976 Showa, 10 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C08L077-00. APPLICATION: JP 75-51460 30 Apr 1975. DOCUMENT TYPE: Patent CA Section: 39 (Textiles) Heat-resistant polyamide compns. with good spinnability contained Na borate [1333-73-9] or lithium borate [12676-27-6], Na phenylphosphinate (I) [4297-95-4] or tri-Ph phosphite [101-02-0], and 1,2,3-trimethyl-2,4,6-tris(3,5-di-tert-butyl-4-hydroxybenzyl)benzene (II) [1709-70-2] or N,N'-bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionyl]hexamethylenedi amine [23128-74-7]. For example, 80 parts dodecamethylenediamine terephthalate, 20 parts dodecamethylenediamine isophthalate, 4.0 mol% (based on combined nylon salts) dodecamethylenediamine, 3.5 mole% benzoic acid, 0.05% Na borate, 0.1% I, 0.1% II, and 67 parts water under N were heated to 15 kg/cm2 gage and >95.degree. over 2 h, depressurized to atm. pressure over 1.5 h while heated to 305.degree., and evacuated at 600 mmHg for 20 min to give polyamide [61751-72-2] which was spun at 300-5.degree. without breakage or fluff formation and drawn 250-350% at 160.degree. to give fiber with tenacity 4.6 g/denier, elongation 29%, Young's modulus 51 g/denier, and b value (yellowness) 2.2, while the fiber heat-treated at 190.degree. for 3 min had tenacity retention 94%, elongation 52%, and b value 3.6.

Polyamide copolymer resin for adhesion

Polyamide copolymer resin for adhesion. Cho, In Sik; Kim, Gi Beom (Hyosung Corporation, S. Korea). Repub. Korean Kongkae Taeho Kongbo KR 2002048240 A 22 Jun 2002, No pp. given (Korean). (Korea, Republic Of). CODEN: KRXXA7. CLASS: ICM: C08G069-36. APPLICATION: KR 2000-77672 18 Dec 2000. DOCUMENT TYPE: Patent CA Section: 38 (Plastics Fabrication and Uses) Section cross-reference(s): 40 Provided is a polyamide copolymer resin which can be used as an adhesive for fiber and electronic and elec. material and has adhesion, antisticking property, low friction coeff. The copolymer resin is prepd. by copolymg. eta-caprolactam (nylon 6), 12-aminododecanoic acid (nylon 12), and at least one mixt. of monomers selected from an isomolar mixt.There are some commonly used reagents with their cas registry numbers 25070-22-8 and 4297-95-4 in this article. of hexamethylene diamine and adipic acid, an isomolar mixt. of hexamethylene and azelaic acid, an isomolar mixt. of hexamethylene diamine and sebacic acid, and a nucleating agent and a lubricant. The nucleating agent is selected from sodium phenylphosphinate and zinc phenylphosphinate, the lubricant is stearic acid, C>12 carboxylic acid and can react with polyamide copolymer resin, and a compd. having an amine group at ends thereof. .