Reference

Inhibiting growth of bacteria, fungi and algae with a lower alkyl tri-N-octyl phosphonium diphenyl phosphate

Inhibiting growth of bacteria, fungi and algae with a lower alkyl tri-N-octyl phosphonium diphenyl phosphate. Baker, Don R. (Stauffer Chemical Co., USA). U.S. US 4017610 12 Apr 1977, 3 pp. (English). (United States of America). CODEN: USXXAM. CLASS: IC: A01N009-36. NCL: 424204000. APPLICATION: US 75-627564 31 Oct 1975. DOCUMENT TYPE: Patent CA Section: 5 (Agrochemicals) Section cross-reference(s): 23 Methyltrioctylphosphonium diphenyl phosphate [62920-96-1] was prepd. by reacting trioctyl phosphine [4731-53-7] with Me diphenyl phosphate [115-89-9]. In in vitro tests, the min. inhibitory concn. of the compd. for control of sulfate- reducing bacteria and mixed culture sulfate- reducing bacteria was 5 .mu.g/mL.

Curable epoxy composition

Curable epoxy composition. Bohnel, Bernd (Minnesota Mining and Mfg. Co., USA). U.S. US 3998763 21 Dec 1976, 9 pp. (English). (United States of America). CODEN: USXXAM. CLASS: IC: C08G059-40. NCL: 260002000EC. APPLICATION: US 75-578989 19 May 1975. DOCUMENT TYPE: Patent CA Section: 36 (Plastics Manufacture and Processing) Epoxy resins are mixed with a salt of a bis(fluoroalkylsulfonyl)methane or fluoroalkanesulfonic acid as a latent crosslinking catalyst, P2O5, and a base (as an acid scavenger for phosphoric acids) to produce a 1-part, latent, moisture- and room temp.-curable epoxy compn., useful as an adhesive, a solid molding, or a structural foam.Several reagents such as 28064-14-4 is used here. Thus, a mixt. of DEN 438 [28064-14-4] 200, DER 732 [9050-88-8] 65, ERL 4221 [25085-98-7] 40, P2O5 10, silica gel 4.5, and trioctylphosphine [4731-53-7] 1.2 parts was heated at 50.degree. for 24 h, and blended with 3 g (CF3SO2)2CHK [33249-12-6]. The mixt. was stirred at 50.degree. for several h to yield an adhesive, which was applied to an Al sheet. The sheet was kept in a normal moisture-contg. atm. until the adhesive developed tackiness, was overlapped with another Al sheet, and the assembly was cured at room temp. and 3.5 kg/cm2 for 24 h and aged 6 days at room temp. The adhesive bond exhibited overlap shear strength 36, 127, and 15 kg/cm2 at -20.degree., +20.degree., and +100.degree., resp. .