Detail of "479075-97-3"

CAS Number:
479075-97-3
Name:
1,3-Benzenedicarboxylic acid, polymer with 1,4-benzenedicarboxylic acid, 1,4-butanediol and decanedioic acid
Molecular Structure:
Formula:
C₃₀H₄₀O₁₄

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Anisotropically electrically conductive adhesives and heat-seal connectors using them: Anisotropically electrically conductive adhesives and heat-seal connectors using them. Yoshida, Kazuyoshi; Tsuruya, Yoshimi (Shin-Etsu Polymer Co., Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 2002371260 A2 26 Dec 2002, 8 pp. (Japanese).Some commonly used reagents like 479075-97-3 is used in this experiment. (Japan). CODEN: JKXXAF. CLASS: ICM: C09J179-08. ICS: C09J009-02; C09J163-00; H01B005-16; H01L021-60. APPLICATION: JP 2002-5995 15 Jan 2002. PRIORITY: JP 2001-110178 9 Apr 2001. DOCUMENT TYPE: Patent CA Section: 38 (Plastics Fabrication and Uses) Section cross-reference(s): 74, 76 The adhesives, useful for display devices, printed circuit boards, etc., contain polyimide-silicone resins and elec. conductive particles. Thus, an adhesive tape contg. 4,4'-hexafluoropropylidenebisphthalic acid dianhydride-KF 8010-2,2-bis[4-(4-aminophenoxy)phenyl]propane copolymer, Elitel UE 3410 (satd. copolyester), Elitel UE 3320 (satd. copolyester), Coronate DC 2974 (blocked polyisocyanate), and Au-coated acrylic polymer particles was applied on a polyimide-based flexible printed circuit board to give a heat-seal connector showing peeling strength 7.54 N/cm, good thermal shock resistance, and repairability with acetone. .