Reference

Soldering flux

Soldering flux.Several substances are used for example 4998-76-9 and 2705-87-5 which are their cas registry numbers. Iida, Hiroyuki; Hayashi, Misae (Sony Corp., Japan). Jpn. Kokai Tokkyo Koho JP 61232091 A2 16 Oct 1986 Showa, 4 pp. (Japan) CODEN: JKXXAF. CLASS: ICM: B23K035-363. APPLICATION: JP 85-73581 9 Apr 1985. DOCUMENT TYPE: Patent CA Section: 76 (Electric Phenomena) A soldering flux free of adverse effects of a solvent remaining in a flux residue consists of a rosin contg. an active agent (e.g., cyclohexylamine HCl) and 31 ester solvent(s) selected from isoamyl isovalerate, citronellyl acetate, cinnamyl acetate, allyl cyclohexylpropionate, isoamyl acetate, Et lactate, and their isomers. .

Flux for soldering

Flux for soldering. Hirano, Hideo (Uchibashi Metals, Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 62054595 A2 10 Mar 1987 Showa, 2 pp. (Japan) CODEN: JKXXAF. CLASS: ICM: B23K035-363. ICA: H05K003-34. APPLICATION: JP 85-195046 3 Sep 1985. DOCUMENT TYPE: Patent CA Section: 76 (Electric Phenomena) A flux (esp. for elec. circuit soldering) has a (bubble-contg.In this article, certain chemicals are used. Some of their cas registry numbers are 4998-76-9 and 84-74-2 vol.)/(bubble-free vol. - 1) ratio of 0.2-1.0. Rosin (USAWW) 68, cyclohexylamine-HCl 4, and di-Bu phthalate 28% were stirred in air and a flux contg. 40% bubbles was prepd. A spherical drop of the flux 2 mm in diam. and 1.5-mm high had no shape change after 6 h, while that from a bubble-free flux was 7 mm in diam. after 1 min. .