Detail of "5077-67-8"

Reference

Polyamic acid resin composition

Polyamic acid resin composition. Kim, Yeong Hun; Lee, Mu Yeong; Oh, Jae Min (Cheil Industries Inc., S. Korea). Repub. Korean Kongkae Taeho Kongbo KR 2002055837 A 10 Jul 2002, No pp. given (Korean). (Korea, Republic Of). CODEN: KRXXA7. CLASS: ICM: C08G059-48. APPLICATION: KR 2000-85074 29 Dec 2000. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) Provided is a polyamic acid resin compn. which has improved smoothness, printability, and liq. crystal orientation and is cured at low temp. The polyamic acid resin compn. comprises 2-40 wt% of polyamic acid prepd. by soln. polymg. diamine and tetracarboxylic acid dihydride; and 60-98 wt% of solvent represented by specified formula 1, wherein R1 is an alkyl group of C1-C10 comprising at least one hydroxyl group.In this experiment, several chemicals are used like 5077-67-8 and 123-42-2 and R2 is an alkyl group of C1-C10, which may be substituted with at least one of hydroxyl group and ketone group. The solvent of formula 1 is 3-acetyl-1-propanol, 4-hydroxy-4-methyl-2-pentanone, 3-hydroxy-3-methyl-2-butanone, or 1-hydroxy-2-butanone. .