Detail of "50940-49-3"

Reference

Curable resin composition

Curable resin composition. Sakamoto, Junichi; Fujimoto, Hiroshi; Miyake, Hideo (Toyobo Co., Ltd., Japan). Ger. Offen. DE 3331476 A1 8 Mar 1984, 28 pp. (German). (Germany). CODEN: GWXXBX. CLASS: IC: C08G059-18; C08F002-50; C08F004-00; C08L063-00; C08J003-24; C08J003-28; C08L033-14. APPLICATION: DE 83-3331476 1 Sep 1983. PRIORITY: JP 82-152936 2 Sep 1982. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) Section cross-reference(s): 42 A photopolymerizable compd. contg. a carboxy group, such as H2C:CHCO2CH2CH2O2CCH2CH2CO2H (I) [50940-49-3] or o-(HO2C)C6H4CO2CH2CH2O2CCH:CH2 [30697-40-6], is mixed with an epoxy compd. contg. 32 epoxy groups/mol. and with 31 photosensitizer to give compns. which are partially cured by radiation (esp. UV light) and then completely cured by heating. The curable compns. are homogeneous, have low viscosity, and are useful as casting resins, coatings, etc. The cured compns. have good adhesion properties, chem. resistance, water resistance, and transparency. Thus, a mixt. of Epikote 828 [25068-38-6] 95, I 108, benzyl di-Me ketal 1, and PhCH2NMe2 1 part, having viscosity 12.5 P, was cast as a 3-mL layer between glass sheets and cured by exposure to UV light followed by heating at 120° for 30 min, giving a cured resin having Barcol hardness 29 and transparency 67%.

Radiation-curable adhesives

Radiation-curable adhesives. (Dainippon Printing Co., Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 58108276 A2 28 Jun 1983 Showa, 4 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C09J003-14. ICA: C08F002-54; C08F265-06. APPLICATION: JP 81-206403 21 Dec 1981. DOCUMENT TYPE: Patent CA Section: 38 (Plastics Fabrication and Uses) Solventless adhesives which can be applied to substrates and radiochem. crosslinked to form hot-melt or pressure-sensitive adhesive layers on tapes comprise 100 parts copolymers contg. 50940-49-3 and 36582-41-9 which are cas registry numbers of chemicals are mentioned. 50-90% Bu acrylate and 10-50% vinyl acetate (mol. wt. 5000-300,000) and 5-40 parts hydroxy-, carboxy-, amino-, epoxy-, or cyanoalkyl acrylate ester monomers. Thus, 100 parts 2::20 acrylic acid-Bu acrylate-diacetoneacrylamide-vinyl acetate copolymer [36582-41-9] and 20 parts 2-hydroxyethyl acrylate [818-61-1] were melt blended at 150°, spread to form a 25-m layer on a polyester film, and crosslinked with 3 Mrad from a 175-kV electron accelerator to obtain a pressure-sensitive adhesive tape having 180° peel strength (at 300 mm/min) 1620 g/25 mm when applied to stainless steel plates. .