Detail of > 6074-84-6
- CAS Number:
- 6074-84-6
- Name:
Ethanol, tantalum(5+)salt (5:1)
- Superlist Name:
- Tantalum(V) ethoxide
- Formula:
- C2H6 O . 1/5 Ta
- Molecular Structure:

- Synonyms:
- Ethanol,tantalum(5+) salt (9CI); Ethyl alcohol, tantalum(5+) salt (8CI); Tantalumethoxide (6CI,7CI); Ditantalum decaethoxide; Pentaethoxytantalum; Pentaethyltantalate; Tantalum ethylate; Tantalum pentaethoxide; Tantalum pentaethylate;Tantalum pentethoxide; Tantalum(5+) ethoxide; Tantalum(V) ethoxide
- Molecular Weight:
- 406.2504
- EINECS:
- 228-010-2
- Density:
- 1.566
- Melting Point:
- 21 °C(lit.)
- Boiling Point:
- 155 °C0.01 mm Hg(lit.)
- Flash Point:
- 87 °F
- Hazard Symbols:


- Risk Codes:
- R10;R34
- Safety:
- 16-26-36/37/39-45Details
- Transport Information:
- UN 2920
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Reference
- Antistatic treatment of plastic surfaces
- Antistatic treatment of plastic surfaces. (Hitachi, Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 60089342 A2 20 May 1985 Showa, 6 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: ICM: B29C071-04. ICA: C08J007-00. APPLICATION: JP 83-195968 21 Oct 1983. DOCUMENT TYPE: Patent CA Section: 38 (Plastics Fabrication and Uses) A plastic is cold plasma-treated using an organometallic compd. to give a durable antistatic surface. Thus, polypropylene (I) [9003-07-0] plasma-treated at 13.56 MHz and 200 W for 30 min in 1 ′ 10-5 torr (EtO)5Ta [6074-84-6] had surface resistivity <1 ′ 109 W initially and £1 ′ 1010 W after 3 mo (vs. 1016-1015 W for untreated I).
- Semiconductor devices and fabrication of devices by formation of gate insulator film in MIS transistors
- Semiconductor devices and fabrication of devices by formation of gate insulator film in MIS transistors. Kadoshima, Masaru; Ubutame, Toshihide; Suzuki, Takaaki; Murata, Yasuhiko (Hitachi Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 2003017686 A2 17 Jan 2003, 7 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: ICM: H01L029-78. ICS: C23C016-40; H01L021-316. APPLICATION: JP 2001-197841 29 Jun 2001. DOCUMENT TYPE: Patent CA Section: 76 (Electric Phenomena) Section cross-reference(s): 57 The title semiconductor devices have a A1-xBxOy (A = Al, Sc, Y, Ln; Ln = rare earth metal; B = Ta, Nb, W; x =0.01-0.3, y =1.5-3.0) layer and an optional SiO2 and/or Si3N4 layer as a gate insulator film formed on a single crystal Si substrate. 6074-84-6 and 75-24-1 which are cas registry numbers of substances are two of reagents here. The A1-xBxOy composite oxide compensates neg. fixed charge in the Al2O3 and/or Ln2O3 gate insulator film, controls flat band voltage shift in the semiconductor devices and consequently gives the MIS transistors high dielec. permittivity gate insulators (gate length £0.1 mm). .
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