Reference

Conducting, nonaqueous, colloidal polysulfone electrodeposition compositions

Conducting, nonaqueous, colloidal polysulfone electrodeposition compositions. Scala, Luciano C.; Phillips, David C. (Westinghouse Electric Corp., USA). Ger. Offen. DE 2615772 28 Oct 1976, 24 pp. (German). (Germany). CODEN: GWXXBX. CLASS: IC: H01B005-16. PRIORITY: US 75-568227 15 Apr 1975. DOCUMENT TYPE: Patent CA Section: 42 (Coatings, Inks, and Related Products) A polysulfone such as P 1700 [25135-51-7] was dissolved in AcNMe2 and N-methyl-2-pyrrolidinone (I) (or Me2SO), mixed with 1-methylimidazole (II) [616-47-7] or Et3N [121-44-8], and mixed with acetone to prep. colloidal compns. useful for the electrophoretic coating of metals. Thus, 5.5 g 380 polysulfone [30528-68-8] was dissolved in 22 g AcNMe2 and 110 g I, treated slowly with 5.2 g II, heated to 40.degree., and mixed slowly with 314 g acetone, and Al was coated electrophoretically with the mixt. and heated to 320.degree. to prep. a tough, flexible, continuous coating.

Epoxy composition

Epoxy composition. Waters, William D. (Youngstown Sheet and Tube Co., USA). U.S. US 4041007 9 Aug 1977, 4 pp. (English). (United States of America). CODEN: USXXAM. CLASS: IC: C08L063-00. NCL: 260037000EP. APPLICATION: US 76-664092 5 Mar 1976. DOCUMENT TYPE: Patent CA Section: 36 (Plastics Manufacture and Processing) Section cross-reference(s): 28 Compns. having extended shelf life are based on an epoxy resin contg. an arom. amine crosslinking agent, a clay filler, and an imidazole deriv. in the concn. range 0.2-12% based on clay filler. Thus, Epon 828 [25068-38-6] 100, arom. amine 25, clay filler 50, and 1-methylimidazole (I) [616-47-7] 0.5 part required 22.5 min to reach a peak exotherm when heated to 190.degree.F, whereas a similar compn. contg. no I took only 6.2 min. Both I and clay filler alone acted as polymn. accelerators for the epoxy compns.