Detail of > 65100-04-1
- CAS Number:
- 65100-04-1
- Name:
2-Propenoic acid,2-methyl-, 3-(diethoxymethylsilyl)propyl ester
- Superlist Name:
- 3-(Diethoxymethylsilyl)propyl methacrylate
- Formula:
- C12H24O4Si
- Molecular Structure:

- Synonyms:
- (3-Methacryloxypropyl)diethoxymethylsilane;(g-Methacryloxypropyl)methyldiethoxysilane;3-(Diethoxymethylsilyl)propyl methacrylate;3-Methacryloxypropylmethyldiethoxysilane;Diethoxy(3-methacryloyloxypropyl)methylsilane;
- Molecular Weight:
- 260.40
- EINECS:
- 242-185-2
- Density:
- 0.965
- Melting Point:
- <0°C
- Boiling Point:
- 95 °C
- Hazard Symbols:

- Risk Codes:
- R14;R34
- Safety:
- S26;S27;S36/37/39;S45Details
- Transport Information:
- UN 2987
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Reference
- Ink for UV curing type backlight and process for producing the same
- Ink for UV curing type backlight and process for producing the same. Kim, Jun Beom; Lee, Dae Seong; Ryu, Jae Myeong (Luvantix Co., Ltd., S. Korea). Repub. Korean Kongkae Taeho Kongbo KR 2002034040 A 8 May 2002, No pp. given (Korean). (Korea, Republic Of). CODEN: KRXXA7. CLASS: ICM: C09D011-10. APPLICATION: KR 2000-64826 2 Nov 2000. DOCUMENT TYPE: Patent CA Section: 42 (Coatings, Inks, and Related Products) Provided is an ink for a UV curing type backlight of an LCD, which can prevent the change in quality compared to an ink for a thermosetting backlight and can improve the drying speed of the ink and the brightness of the backlight. The ink for the UV curing type backlight is produced by a process comprising the steps of: mixing tetramethoxysilane and 0.1-1.0% HCl water soln. in the wt. ratio of 2:1-3:1; adding 20-50 wt% of an acryloxy-functional silane to the mixt. 65100-04-1 and 13463-67-7 are also in the experiment. to obtain a colloidal silica soln. of which the surface is treated by the acryloxy-functional silane, wherein the acryloxy-functional silane is at least one selected from the group consisting of acryloxypropyl trimethoxy silane, acryloxypropyl triethoxy silane, methacryloxypropyl Me diethoxy silane, and etc.; adding 20-50 wt% of hexanediol diacrylate to the silica soln.; eliminating an alc. soln. and moisture; adding 5-15 wt% of epoxy acrylate, 1-5 wt% of isobutylbenzene ether, and 5-12 wt% of a filler contg. SiO2, TiO2, and BaSO4 having an av. particle size of less than 10 mm. .
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