Detail of "6542-67-2"

Reference

Photopolymerizable composition

Photopolymerizable composition. Ishikawa, Shunichi; Iwasaki, Masayuki; Tamoto, Koji; Umehara, Akira (Fuji Photo Film Co., Ltd. , Japan). Eur. Pat. Appl. EP 109291 A1 23 May 1984, 54 pp.In this experiment, several chemicals are used like 67332-64-3 DESIGNATED STATES: R: DE, GB. (English). (European Patent Organization). CODEN: EPXXDW. CLASS: IC: C08F002-50; G03C001-68. APPLICATION: EP 83-306920 11 Nov 1983. PRIORITY: JP 82-198363 12 Nov 1982. DOCUMENT TYPE: Patent CA Section: 35 (Chemistry of Synthetic High Polymers) A photopolymerizable compn. having improved sensitivity comprises an ethylenically unsatd. compd. and a photopolymn. catalyst comprising I (R, R1 = H, alkyl, aryl, or arylalkyl group; R2 = substituent having Hammett's value <0.7; R3 = H , alkyl, aryl, arylalkyl, acyl, or alkoxycarbonyl group) and a 1,3,5-triazine compd. Thus, a mixt. of pentaerythritol tetraacrylate 40, II [67332-64-3] 2, 2,4,6-tris(trichloromethyl)-1,3,5-triazine (III) [6542-67-2] 2, and benzyl methacrylate-methacrylic acid copolymer [65697-21-4] 60 g, MEK 400 mL, and methyl Cellosolve acetate 300 mL was coated on 0.24-mm Al plate and dried at 80° for 10 min to give a photosensitive material (A). A 10-m-thick poly(ethylene terephthalate) (IV) film was laminated on A. The photosensitive layer A was scanned by Ar laser at 10 m/s. IV film was sepd. and A was developed using a developer contg. a mixt. of 10 g Na2CO3, 5 g butyl Cellosolve, and 1 L water. The min. scanning amt. of Ar laser light capable of forming an image was 10 mW, compared with >500 mW using a photosensitive, material without III. .

Photoresists for printed circuit boards

Photoresists for printed circuit boards. Nagasaka, Hideki; Takahashi, Noriaki (Mitsubishi Chemical Industries Co., Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 61093450 A2 12 May 1986 Showa, 7 pp. (Japan) CODEN: JKXXAF. CLASS: ICM: G03C001-68. APPLICATION: JP 84-213895 12 Oct 1984. DOCUMENT TYPE: Patent CA Section: 74 (Radiation Chemistry, Photochemistry, and Photographic and Other Reprographic Processes) Section cross-reference(s): 76 The title compns., which give protective masks to printed boards with good image-forming property and heat and solvent resistance, comprise photopolymn. initiators, 32 terminal ethylene group-contg. polymerizable monomers, and unsatd. polymers obtained by copolymn. of non-acidic vinyl monomers and (meth)acrylate semiesters of lower aliph.There are some reagents with their cas registry numbers 6542-67-2 and 55205-38-4 are used in this study. diol compds. which may be substituted with aryl or aryloxy groups. Thus, Me methacrylate 0.26, Et acrylate 0.06, and 2-hydroxypropyl acrylate 0.08 mol were stirred in dioxane in the presence of Bz2O2 at 95° under N for 8 h to obtain a linear polymer (av. mol. wt. 4.8 ′ 104), 14.2 g of which was mixed with 4.2 g acrylic chloride, 0.1 g p-methoxyphenol, and 50 mL CHCl2CHCl2, heated 2 h at 80° and 3 h at 95° to obtain 13.5 g unsatd. polymer (I) contg. 73 mol% acrylic group. Then, 4.5 g I, 3.0 g DPCA-60 (acrylate monomer), 300 mg benzophenone, 12 mg Michler's ketone, and 4 mg Victoria Pure Blue were dissolved in 10 g MEK, coated on a 25-m PET film, and dried to form a 30-m film. The resulting dry-film photoresist was laminated onto a paper-phenol laminate and imagewise exposed with a high-pressure Hg lamp to give a resist image with high resoln., showing excellent solvent resistance (Trichlene at 25° for 10 min), heat resistance (in molten solder bath at 260° for 30 s), pencil hardness (on the resist surface) >4 H, and insulation resistance >1 ′ 1012 W, while a resist prepd. similarly using 1:9 Me acrylate-Me methacrylate copolymer (av. mol. wt. 8.5 ′ 104) instead of I showed inferior solvent and heat resistance. .