Detail of > 693-98-1
- CAS Number:
- 693-98-1
- Name:
2-Methylimidazole
- Formula:
- C4H6N2
- Molecular Structure:

- Synonyms:
- 2-Methyl imidazole;2-methyl-1H-imidazole;Imidazole, 2-methyl-;2,4-diamino-6-[2'-methyl imidazolyl-(1')]-ethyl-s-triazine;1H-Imidazole, 2-methyl-;Curezol 2MZ;1H-Imidazole,2-methyl-;1H-imidazole, 1-butyl-;
- Molecular Weight:
- 82.11
- EINECS:
- 211-765-7
- Density:
- 1.062 g/cm3
- Melting Point:
- 142-143 °C(lit.)
- Boiling Point:
- 267 °C at 760 mmHg
- Flash Point:
- 144.9 °C
- Appearance:
- white to light yellow crystalline powder
- Hazard Symbols:
C- Risk Codes:
- 26-36/37/39-45-25
- Safety:
- 26-36/37/39-45-25Details
- Transport Information:
- UN 3259 8/PG 2
- Deleted CAS:
- 79103-58-5
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Reference
- Potting materials for electronic parts
- Potting materials for electronic parts. (Hitachi Chemical Co., Ltd., Japan). Jpn. Kokai Tokkyo Koho JP 59204614 A2 20 Nov 1984 Showa, 4 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: IC: C08G059-62; H01L023-30. APPLICATION: JP 83-79822 7 May 1983. DOCUMENT TYPE: Patent CA Section: 37 (Plastics Manufacture and Processing) The potting materials having excellent pot life contain finely powd. epoxy resins, phenolic novolak hardeners, catalysts, and fillers compacted at compression ratio >0.8. Thus, Araldite ECN 1280 [63992-68-7] 100, fused silica 240, stearic acid (I) 0.7, carbon black 0.7, and g-glycidoxypropyltrimethoxysilane (II) 1.0 part were melt-mixed at 90° for 5 min into a sheet, and a sheet was prepd. similarly from HP-208 [96119-44-7] (phenolic novolak; softening point 85°) 45, 2-methylimidazole [693-98-1] 1, silica 120, I, 0.3, carbon black 0.3, and II 0.5 part. The two sheets were granulated, mixed, and pulverized at 7400 rpm to prep. a fine powder (particle size <100 m; £44 m 378%), which were pelletized at compression ratio 0.85 to obtain a potting compd. The compd. was molded at 180° for 2 min and cured at 180° for 5 h to give a specimen with vol. resistivity 6.5 ′ 1014 W.cm (100°) and 5.8 ′ 1014 W.cm after 100 h in steam at 120°, glass transition temp. 152°, gel time 30 s, spiral flow 97 cm (80°, 70 kg/cm2), and good pot life (90% retention of fluidity after 30 days at 40°).
- Synthetic fiber manufacture
- Synthetic fiber manufacture. (Dainippon Ink and Chemicals, Inc., Japan). Jpn. Kokai Tokkyo Koho JP 59228073 A2 21 Dec 1984 Showa, 2 pp. (Japanese). (Japan). CODEN: JKXXAF. CLASS: ICM: D06M013-36. ICS: D01F011-08; D06M013-38. ICA: D01F006-76. APPLICATION: JP 83-103967 10 Jun 1983. DOCUMENT TYPE: Patent CA Section: 40 (Textiles) Novolak phenolic resin adducts with a high-mol.-wt. epoxy resin are melt-spun and treated with an amine as a crosslinking agent to give strong and heat-resistant synthetic fibers. Thus, melted Epiclon 4050 (Bisphenol A epoxy resin; no. av. mol. wt. 2000) was copolymd. with Polyophen KH8880 (novolak phenolic resin) to give a copolymer [96210-27-4] which was melt-spun, drawn, and solidified. The spun fibers were treated with aq. 10% 2-methylimidazole [693-98-1] and heat-treated 1 h at 150° to give fibers with tensile strength 3.8 g/denier and low discoloration after oxidn. for 5 h at 180°, compared with tenacity 2.6 g/denier and high discoloration for com. novolak fibers.
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