Reference

Compositions for porous organic film with low dielectric constant

Compositions for porous organic film with low dielectric constant. Satoh, Naoya; Yoshida, Yuji; Yokota, Akira (Sumitomo Chemical Company, Limited, Japan). U.S. Pat. Appl. Publ. US 2005025892 A1 3 Feb 2005, 15 pp. (English). (United States of America). CODEN: USXXCO. CLASS: ICM: B05D003-02. APPLICATION: US 2003-694400 28 Oct 2003. PRIORITY: JP 2002-319508 1 Nov 2002; JP 2003-180648 25 Jun 2003. DOCUMENT TYPE: Patent CA Section: 38 (Plastics Fabrication and Uses) Section cross-reference(s): 76 The present invention provides a compn. comprising (A) 31 selected from an arom. polymer having a repeating unit I and a monomer having 32 CYCH groups and (B) 31 selected from a heat transpirable compd.In this article, certain chemicals are used. Some of their cas registry numbers are 600736-93-4 and 876-53-9 and a heat decomposable compd., wherein Ar1 = (substituted) arom. ring excluding CYCH substituent; X1, X2 = direct bond, (substituted) C1-20 alkylene, CR1:CR2, CYC, (substituted) divalent group having an arom. ring, (substituted) divalent group having alicyclic hydrocarbob ring, O, CO, COO, S, SO, SO2, NR3, or CONR4; R1, R2, R3, R4 = H or (substituted) C1-20 alkyl or alkoxy, (substituted) C4-20 alicyclic hydrocarbon, (substituted) aryl; Y1 = divalent org. group; and n = 31 integer. Thus, 9.6 g 9,9-bis(4-dihydroxyphenyl)fluorene and 5.4 g 1-(trimethylsilylethynyl)-2,4-difluorobenzene were reacted at 120° for 12 h, at 130° for 2 h, and at 150° for 4 h to give a copolymer with wt. av. mol. wt. 7600, 65 parts of which was mixed with 35 parts a-methylstyrene homopolymer with wt. av. mol. wt. 4600 in anisole, applied on a silicon wafer, baked at 150° for 1 min and 400° for 30 min to give a test piece with dielec. const. 2.35. .