19958-75-9 Usage
General Description
N,N-Dimethyl-N'-(4-methylthiazol-2-yl)thiourea is a chemical compound with the molecular formula C7H10N4S and a molar mass of 186.25 g/mol. It is a thiourea derivative that contains a dimethylamino group and a 4-methylthiazol-2-yl group. N,N-Dimethyl-N'-(4-methylthiazol-2-yl)thiourea is commonly used in the pharmaceutical and agricultural industries, where it acts as a fungicide and antimicrobial agent. It works by inhibiting the growth of fungi and bacteria, thus protecting crops and pharmaceutical products from spoilage. Additionally, it has potential applications in the field of medicine, where it may be used for the treatment of various infections. Furthermore, it is important to handle this chemical compound with caution, as prolonged or high-level exposure may cause irritation to the skin, eyes, and respiratory system.
Check Digit Verification of cas no
The CAS Registry Mumber 19958-75-9 includes 8 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 5 digits, 1,9,9,5 and 8 respectively; the second part has 2 digits, 7 and 5 respectively.
Calculate Digit Verification of CAS Registry Number 19958-75:
(7*1)+(6*9)+(5*9)+(4*5)+(3*8)+(2*7)+(1*5)=169
169 % 10 = 9
So 19958-75-9 is a valid CAS Registry Number.
InChI:InChI=1/C7H11N3S2/c1-5-4-12-6(8-5)9-7(11)10(2)3/h4H,1-3H3,(H,8,9,11)
19958-75-9Relevant articles and documents
A carrier mounted on the reverse [...] from separating from the method and device
-
, (2007/10/05)
New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed from those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate that have only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided.