37746-25-1Relevant articles and documents
Preparation method of high-heat-resistance diepoxide
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Paragraph 0039; 0042-0043; 0047; 0050-0053, (2021/05/29)
The invention discloses a preparation method of a high-heat-resistance diepoxide. The preparation method comprises the following steps: in the presence of 4-toluenesulfonyl chloride and pyridine, reacting 4, 4'- dihydroxydicyclohexane with a metal halide; then carrying out dehalogenation in an alkaline environment to prepare [1, 1' -bis(cyclohexane)]-3, 3' -diene; or in the presence of thiourea, 4, 4apos;-dihydroxy dicyclohexane is subjected to a reaction with halogenated succinimide; then carrying out dehalogenation in an alkaline environment to prepare [1, 1'-bis(cyclohexane)]-3, 3'-diene; and then reacting the[1, 1'-bis(cyclohexane)]-3, 3'-diene with peroxyacetic acid to produce the diepoxide. An existing method has the technical defects of high energy consumption, poor selectivity and the like, isomers exist when a hydroxyl group is dehydrated in a strongly acidic environment, rectification purification is needed, and the product yield is low, and based on the problems, technical innovation is carried out, the hydroxyl group is halogenated firstly, then double bonds are formed in a strongly alkaline environment, post-treatment steps are simplified, and especially, the existence of an isomer is avoided, and the (3, 4, 3 ', 4'-diepoxy)bicyclohexane can be efficiently and conveniently prepared.
PHOTOCURABLE COMPOSITION, CURED PRODUCT AND OPTICAL COMPONENT USING SAME
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Paragraph 0140-0141, (2018/05/26)
Provided is a photocurable composition which less causes resin-induced swelling of molds, allows the molds to endure more satisfactorily, and has excellent economic efficiency. This photocurable composition includes components (A), (B), (C), and (D). The component (A) is present in a content of 10 to 50 weight percent of the totality of photocurable compounds contained in the photocurable composition. The component (A) is a cycloaliphatic epoxy compound represented by Formula (a). The component (B) is an oxetane compound having a solubility parameter of 9.5 (cal/cm3)1/2 or more as determined by the Fedors' method. The component (C) is a glycidyl ether epoxy compound having a molecular weight of 250 or more. The component (D) is a photoinitiator: wherein R1 to R18 are each, identically or differently, selected from hydrogen, halogen, a hydrocarbon group optionally containing oxygen or halogen, and optionally substituted alkoxy; and X is selected from a single bond and a linkage group.
PREPARATION OF ALICYCLIC DIEPOXIDES
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Page/Page column 18-20, (2010/04/28)
Embodiments in accordance with the present invention provide alicyclic diepoxide compounds and methods for forming such compounds. Such methods encompass charging a reaction vessel with an appropriate diene and an appropriate dienophile and causing such to react to form and recover a desired alicyclic diepoxide precursor where such precursor is subsequently epoxidized. Such compounds encompass alicyclic diepoxides having purities of at least 95 percent or at least 98 percent with respect non-isomeric residues and are essentially free of any isomeric alicyclic diepoxide residues.