636-46-4Relevant articles and documents
Yasuhara,Nogi
, p. 4512 (1968)
Method for extracting 4-hydroxy-m-phthalic acid from wintergreen oil production waste slag
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Paragraph 0026; 0027, (2017/01/17)
The invention discloses a method for extracting 4-hydroxy-m-phthalic acid from wintergreen oil production waste slag. The method comprises the following steps: 1. extraction of 4-hydroxy-dimethyl isophthalate crude product from wintergreen oil production waste slag: dissolving wintergreen oil production waste slag in an organic solvent, heating, filtering while the solution is hot, standing the filtrate to precipitate a solid, and drying the filter cake to obtain the 4-hydroxy-dimethyl isophthalate crude product; 2. hydrolysis of 4-hydroxy-dimethyl isophthalate crude product: adding the 4-hydroxy-dimethyl isophthalate crude product into an alkali solution, heating for hydrolysis, cooling to room temperature, adding a decolorant for decolorization, regulating the pH value of the filtrate to 1-4, precipitating a solid under acidic conditions, collecting the filter cake, and carrying out vacuum drying. By recycling the wintergreen oil production waste slag, the method enhances the resource utilization rate and lowers the 4-hydroxy-m-phthalic acid production cost. Besides, the method has the advantages of high yield, high purity, simple technique, mild conditions, no side reaction and the like.
Inclusion complex containing epoxy resin composition for semiconductor encapsulation
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, (2014/03/21)
The invention is an epoxy resin composition for sealing a semiconductor, including (A) an epoxy resin and (B) a clathrate complex. The clathrate complex is one of (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II): wherein R2 represents a hydrogen atom, C1-C10 alkyl group, phenyl group, benzyl group or cyanoethyl group, and R3 to R5 represent a hydrogen atom, nitro group, halogen atom, C1-C20 alkyl group, phenyl group, benzyl group, hydroxymethyl group or C1-C20 acyl group. The composition has improved storage stability, retains flowability when sealing, and achieves an effective curing rate applicable for sealing delicate semiconductors.