1001-46-3

Basic information

• Product Name: Di-n-Hexyl(methyl)silane
• Synonyms: Di-n-Hexyl(methyl)silane;methyl(dioctyl)silane
• CAS NO: 1001-46-3
• Molecular Formula: C13H30Si
• Molecular Weight: 214.4628
• EINECS: -0
• Mol File: 1001-46-3.mol
• Article Data: 1

Chemical Properties

• Boiling Point: 256.604°C at 760 mmHg
• Flash Point: 108.991°C
• Appearance: /
• Vapor Pressure: 0.025mmHg at 25°C
• CAS DataBase Reference: Di-n-Hexyl(methyl)silane(CAS DataBase Reference)
• NIST Chemistry Reference: Di-n-Hexyl(methyl)silane(1001-46-3)
• EPA Substance Registry System: Di-n-Hexyl(methyl)silane(1001-46-3)

Safety Data

• Hazardous Substances Data: 1001-46-3(Hazardous Substances Data)

Usage

General Description

Di-n-Hexyl(methyl)silane is a chemical compound with the molecular formula C18H40Si. It is a silane compound, which contains silicon and hydrogen atoms bonded to organic groups. Di-n-Hexyl(methyl)silane is commonly used as a hydrophobic coating agent and lubricant in various industrial applications. It is also used as a cross-linking agent in the production of silicone rubbers and resins. This chemical is flammable and should be handled with caution in a well-ventilated area. Additionally, it may be harmful if swallowed, inhaled, or absorbed through the skin, so proper safety measures should be followed when handling this substance.

InChI:InChI=1/C13H30Si/c1-3-5-7-9-11-13(14)12-10-8-6-4-2/h13H,3-12H2,1-2,14H3

Upstream product

• 75-54-7 Dichloromethylsilane 
• 3761-92-0 n-hexylmagnesium bromide 
• 26015-61-2 Methyl-hexyl-chlorosilan 

Downstream Products

• 35501-28-1 (3-Aminopropyl)-dihexyl-methylsilan 
• 1044-86-6 4-(Dihexyl-methyl-silyloxy)-1-vinyl-benzol 
• 1045-52-9 4-(Dihexyl-methyl-silyloxy)-1-(1-hydroxy-ethyl)-benzol 
• 1041-28-7 (4-Brom-phenoxy)-dihexyl-methyl-silan 

Relevant articles and documents

Predictability of thermal and electrical properties of end-capped oligothiophenes by a simple bulkiness parameter

The branching topology of end groups attached to several series of oligothiophenes has a systematic effect on thermal and electrical properties of the oligomers. The series were synthesized in a modular approach and show a distinct drop of the melting point Tm on increasing bulkiness of the substituents. The same trend can be found for the dissociation temperatures Tdis of aggregates in solution. Similarly, monolayer OFET mobilities μFET are significantly decreasing with increasing bulkiness of the substituents. A simple geometric model is presented quantitatively correlating the transition temperatures and mobilities with the substituents' structure based on a bulkiness parameter P, which allows predicting Tm, T dis, and μFET of corresponding not yet synthesized oligomers with branched substituents. This model might be generally applicable for end-capped rod-like conjugated oligomers.