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7440-50-8 Usage

Check Digit Verification of cas no

The CAS Registry Mumber 7440-50-8 includes 7 digits separated into 3 groups by hyphens. The first part of the number,starting from the left, has 4 digits, 7,4,4 and 0 respectively; the second part has 2 digits, 5 and 0 respectively.
Calculate Digit Verification of CAS Registry Number 7440-50:
(6*7)+(5*4)+(4*4)+(3*0)+(2*5)+(1*0)=88
88 % 10 = 8
So 7440-50-8 is a valid CAS Registry Number.
InChI:InChI=1/Cu/q+2

7440-50-8 Well-known Company Product Price

  • Brand
  • (Code)Product description
  • CAS number
  • Packaging
  • Price
  • Detail
  • Alfa Aesar

  • (45504)  Copper nanopowder, APS 20-50nm, 99.9% (metals basis)   

  • 7440-50-8

  • 5g

  • 2071.0CNY

  • Detail
  • Alfa Aesar

  • (45504)  Copper nanopowder, APS 20-50nm, 99.9% (metals basis)   

  • 7440-50-8

  • 25g

  • 6901.0CNY

  • Detail
  • Alfa Aesar

  • (45943)  Copper Thinfoil, Oxygen-Free High Conductivity (OFHC), 0.008mm (0.0003in) thick, 99.99% (metals basis)   

  • 7440-50-8

  • 25x25mm

  • 441.0CNY

  • Detail
  • Alfa Aesar

  • (45943)  Copper Thinfoil, Oxygen-Free High Conductivity (OFHC), 0.008mm (0.0003in) thick, 99.99% (metals basis)   

  • 7440-50-8

  • 50x50mm

  • 1104.0CNY

  • Detail
  • Alfa Aesar

  • (45943)  Copper Thinfoil, Oxygen-Free High Conductivity (OFHC), 0.008mm (0.0003in) thick, 99.99% (metals basis)   

  • 7440-50-8

  • 100x100mm

  • 3873.0CNY

  • Detail
  • Alfa Aesar

  • (42352)  Copper slug, 3.175mm (0.125in) dia x 3.175mm (0.125in) length, 99.995% (metals basis)   

  • 7440-50-8

  • 10g

  • 211.0CNY

  • Detail
  • Alfa Aesar

  • (42352)  Copper slug, 3.175mm (0.125in) dia x 3.175mm (0.125in) length, 99.995% (metals basis)   

  • 7440-50-8

  • 50g

  • 895.0CNY

  • Detail
  • Alfa Aesar

  • (42958)  Copper slug, 3.175mm (0.125in) dia x 3.175mm (0.125in) length, Puratronic?, 99.9999% (metals basis)   

  • 7440-50-8

  • 10g

  • 570.0CNY

  • Detail
  • Alfa Aesar

  • (42958)  Copper slug, 3.175mm (0.125in) dia x 3.175mm (0.125in) length, Puratronic?, 99.9999% (metals basis)   

  • 7440-50-8

  • 50g

  • 2130.0CNY

  • Detail
  • Alfa Aesar

  • (44258)  Copper slug, 3.175mm (0.125in) dia x 6.35mm (0.25in) length, 99.995+% (metals basis), Oxygen free   

  • 7440-50-8

  • 10g

  • 174.0CNY

  • Detail
  • Alfa Aesar

  • (44258)  Copper slug, 3.175mm (0.125in) dia x 6.35mm (0.25in) length, 99.995+% (metals basis), Oxygen free   

  • 7440-50-8

  • 50g

  • 678.0CNY

  • Detail
  • Alfa Aesar

  • (42959)  Copper slug, 3.175mm (0.125in) dia x 6.35mm (0.25in) length, Puratronic?, 99.9999% (metals basis)   

  • 7440-50-8

  • 10g

  • 462.0CNY

  • Detail

7440-50-8SDS

SAFETY DATA SHEETS

According to Globally Harmonized System of Classification and Labelling of Chemicals (GHS) - Sixth revised edition

Version: 1.0

Creation Date: Aug 16, 2017

Revision Date: Aug 16, 2017

1.Identification

1.1 GHS Product identifier

Product name copper atom

1.2 Other means of identification

Product number -
Other names cda102

1.3 Recommended use of the chemical and restrictions on use

Identified uses For industry use only. Inorganic substances
Uses advised against no data available

1.4 Supplier's details

1.5 Emergency phone number

Emergency phone number -
Service hours Monday to Friday, 9am-5pm (Standard time zone: UTC/GMT +8 hours).

More Details:7440-50-8 SDS

7440-50-8Synthetic route

Conditions
ConditionsYield
In gaseous matrix byproducts: CuH2(1-), CuD2(1-), H2O; co-deposition of laser-ablated copper with HD in excess Ar at 3.5 K for 60 min; monitoring by IR;
copper dimer
860263-67-8

copper dimer

methane
34557-54-5

methane

copper(I) hydride
7440-50-8

copper(I) hydride

Conditions
ConditionsYield
In gaseous matrix byproducts: CH3; Irradiation (UV/VIS); photoexcitation of Cu2, reaction of Cu-fragments with CH4;

7440-50-8Relevant articles and documents

Hierarchical Copper with Inherent Hydrophobicity Mitigates Electrode Flooding for High-Rate CO2 Electroreduction to Multicarbon Products

Niu, Zhuang-Zhuang,Gao, Fei-Yue,Zhang, Xiao-Long,Yang, Peng-Peng,Liu, Ren,Chi, Li-Ping,Wu, Zhi-Zheng,Qin, Shuai,Yu, Xingxing,Gao, Min-Rui

, p. 8011 - 8021 (2021/05/29)

Copper is currently the material with the most promise as catalyst to drive carbon dioxide (CO2) electroreduction to produce value-added multicarbon (C2+) compounds. However, a copper catalyst on a carbon-based gas diffusion layer electrode often has poor stability - especially when performing at high current densities - owing to electrolyte flooding caused by the hydrophobicity decrease of the gas diffusion layer during operation. Here, we report a bioinspired copper catalyst on a gas diffusion layer that mimics the unique hierarchical structuring of Setaria's hydrophobic leaves. This hierarchical copper structure endows the CO2 reduction electrode with sufficient hydrophobicity to build a robust gas-liquid-solid triple-phase boundary, which can not only trap more CO2 close to the active copper surface but also effectively resist electrolyte flooding even under high-rate operation. We consequently achieved a high C2+ production rate of 255 ± 5.7 mA cm-2 with a 64 ± 1.4% faradaic efficiency, as well as outstanding operational stability at 300 mA cm-2 over 45 h in a flow reactor, largely outperforming its wettable copper counterparts.

Synthesis of an Ag@AgCl catalyst with amorphous copper as the support and its catalytic performance in the reduction of 4-nitrophenol

Bao, Lei,Dong, Hanfeng,Fu, Xucheng,Gan, Wei,Hao, Hequn,Liu, Luying,Qin, Chenchen,Wang, Yujuan,Zhang, Jian

, p. 551 - 557 (2020/07/24)

The support used in a composite catalyst has an important influence on the catalytic performance of the catalyst. Amorphous metals have good electron-transfer properties and the presence of defect structures on the surface will introduce additional active sites and should be excellent catalyst supports. In this study, an Ag@AgCl composite catalyst with amorphous Cu (a-Cu) as the support is prepared by a two-step precipitation method at room temperature and a light irradiation reduction method. Compared to the Ag@AgCl and a-Cu, the catalytic rate of the Ag@AgCl/a-Cu composite catalytic rate was 2.04 times and 6.69 times faster during the reduction of 4-NP in NaBH4 aqueous solution. The high-performance catalytic efficiency and reusability of Ag@AgCl/a-Cu may be attributed to the synergistic effect between Ag@AgC and amorphous metal elements. This work may provide an effective reference for the synthesis of high activity catalysts using amorphous metals as supports.

The composition dependent structure and catalytic activity of nanostructured Cu-Ni bimetallic oxides

Preethi, S.,Sundramoorthy, Ashok K.,Suresh Babu, K.,Vivek, S.

, p. 9691 - 9698 (2020/07/03)

Nanostructured bimetallic oxides have received a great amount of attention in the field of catalysis. Here, the influence of composition on the structure and catalytic activity of CuO/NiO bimetal oxides is reported. Oxides with different ratios of Cu : Ni (0 : 100, 25 : 75, 50 : 50, 75 : 25 and 100 : 0) were prepared via a hydrothermal process and subsequently heat-treated at 600 °C for 4 h. XRD and Raman spectroscopic analysis clearly indicated the co-existence of NiO and CuO phases in the bimetallic oxides. Electron microscopy studies revealed a reduction in particle size for the bimetallic oxide compared to the monometallic oxide. The highest catalytic activity with good recyclability for the reduction of 4-nitrophenol was observed with Cu50Ni50-600, having a rate constant of 5.08 × 10-3 s-1. Cyclic voltammetry investigations confirmed the high reactivity of Cu50Ni50-600 for 4-nitrophenol, showing a high oxidation current peak compared to that of other samples. The results show that the presence of CuO and NiO enhances the catalytic activity by their synergetic effect, unlike the monometal oxides. This journal is

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