A high molecular weight thermoplastic copolymer of bisphenol A and epichlorohydrin having the basic molecular structure [OC6H4C(CH3)2C6H4OCH2CH(OH)CH2]n (n is about 100). It uses the same raw materials as epoxy resins but contains no epoxy groups. It may be cured by reacting with polyisocyanates, anhydrides, or other cross-linking agent capable of reacting with hydroxyl groups.The ductility of phenoxy resins resembles that of metals. They are transparent and also characterized by low mold shrinkage, good dimensional stability, and moderately good resistance to temperature and corrosion. Phenoxy resins are soluble in methyl ethyl ketone and have been used for coatings and adhesives. A typical injection-molded specimen has a tensile strength of 9000 psi, heat distortion point 86.6C at 264 psi load, and d 1.18.They may be extruded or blow molded. Parts may be thermally formed and heat or solvent welded. Some applications are blow-molded containers, pipe, ventilating ducts, and molded parts.